Development of a new Chemical Mechanical Polishing (CMP) machine, assisted by the photocatalytic reactions and electrolytic actions in the atmosphere controlled sealed CMP chamber

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Based on the characteristics and mechanism of CMP (Chemical Mechanical Polishing) obtained through the experiments, we have designed and manufactured a prototype of a sealed, bell-jar shaped, both-side simultaneous CMP machine. This innovative machine, assisted by the photocatalytic reactions inside the sealed Bell-Jar chamber while ultra-violet being applied, has realized integration of high efficiency CMP and both-side simultaneous polishing into one machine. This integrated machine provides 4.5 times higher polishing efficiency with hard-to-process SiC wafers than that of the conventional machine, and consequently, is drawing attentions from the industries as next generation CMP machine.