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On A Reliability Evaluation Method for Electronic Devices Considering Thermal Stress Generated by the Manufacturing Process Based on Super Imposed Method

基于叠加法的考虑制造过程热应力的电子器件可靠性评估方法

基本信息

批准号：
14350057
负责人：
ZAKO Masaru
金额：
$ 8.9万
依托单位：
Osaka University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2003
项目状态：
已结题

项目摘要

A micro-electronic circuit on a plastic film has been expected as one of the future information-communication devices. In order to realize, the aims of this study are to establish a multi-scale numerical analysis and an experimental method for the measurement of the mechanical properties of the film with the residual stress generated by the manufacturing process.An important point for evaluation of reliability of the devices is to comprehend the stress state acted on the structure under applied load and the mechanism of the damage mode. New fatigue testing apparatus to detect the damage using a laser microscope had been developed. The mechanism of damage development of the plastic film and woven fabric composites for the substrate of the electric devices under load had been investigated with In-situ observation during the static test and fatigue test.Since the experimental results of fatigue test show large scatter, the statistical method was proposed in order to decide the fatigue strength for design. The design margin can be decided by the probability of failure and confidence level considering an effect of small samples. The stress level with a margin can be decided by the proposed method. Furthermore, the super impose method, which is one of the multi-scale numerical methods, had been developed in order to analyze the local stress conditions and behavior of the global deformation considering an effect of the thermal stress. The proposed procedure has superior properties about accuracy and computational cost than the traditional method. It is revealed that the proposed numerical and experimental methods are very useful for the reliability and lifetime evaluations for the electronic devices.

塑料薄膜上的微电子电路有望成为未来的信息通信设备之一。为了实现这一目标，本研究的目的是建立一种多尺度数值分析和实验方法，用于测量具有制造过程中产生的残余应力的薄膜的机械性能。评估器件可靠性的一个重要点是了解在施加载荷下作用在结构上的应力状态和损坏模式的机制。已经开发出使用激光显微镜检测损伤的新型疲劳测试设备。通过静态试验和疲劳试验过程中的原位观察，研究了电子器件基材塑料薄膜与编织布复合材料在载荷作用下的损伤发展机理。针对疲劳试验结果分散性较大的问题，提出了采用统计方法来确定设计的疲劳强度。考虑小样本的影响，设计裕度可以通过失败概率和置信水平来确定。具有裕度的应力水平可以通过所提出的方法来确定。此外，还开发了多尺度数值方法之一的叠加方法，以分析考虑热应力影响的局部应力条件和全局变形行为。与传统方法相比，所提出的过程在准确性和计算成本方面具有优越的特性。结果表明，所提出的数值和实验方法对于电子设备的可靠性和寿命评估非常有用。