High Efficiency and High Accuracy Multi-wire EDM Slicing Method of Monocrystalline Silicon Ingot

研究了单晶硅电火花线切割的高效、高精度切割方法，并在第一年(2002财年)试制了单丝电极电火花线切割专用设备。与常用的商用电火花线切割设备相比，该设备可以产生相对较低的峰值和较长的脉冲宽度。此外，网速为10米/S，比商用网速快。该设备可以实现与传统的多丝埋弧焊加工方法相比，加工精度几乎相同，加工速度更快。第二年(2003财年)，我们在第一年(2003财年)的基础上试验开发了多线切割切割设备，以达到高效加工的目的。在该系统的情况下，由于观察到放电浓度…，传统的ISO脉冲系统不能获得稳定的处理更多采用单线多电源系统。因此，我们研究了同时产生所有脉冲的同时脉冲系统。与ISO脉冲系统相比，这种同步脉冲系统具有更好的加工效果。在过去的一年(2004财年)，我们改进了新开发的多线电火花切割设备，并对其特性进行了研究。通过改变导电片位置，重新设置导丝副导轨，改进工作液供给方式，可实现稳定加工。结果表明，提高丝速可获得较好的开槽形状，适当控制放电条件也可获得较好的加工表面。此外，三丝电极的去除效果与单丝电极相当，且割缝形状也较好。因此，利用本研究开发的新设备，证实了多丝电火花加工方法具有高效、高精度切割单晶硅锭的可能性。较少

High efficiency and high accuracy slicing method of monocrystalline silicon ingot by wire EDM, in which machining force is relatively small because of non-contact processing, were investigated.In the first year (FY2002), special electrical discharge slicing equipment with one wire electrode was experimentally manufactured. This equipment can generate relatively low peak and long duration pulse compared to usual commercial wire EDM equipment. Besides, wire speed is 10m/s and faster than commercial one. This equipment could realize that machining accuracy was almost same and removal rate was faster compared to conventional multi-wire saw method.In the second year (FY2003), we experimentally developed multi-wire EDM slicing equipment based on the results obtained in the first year for the purpose of high efficiency processing. In the case of this system, stable processing could not be obtained by traditional ISO pulse system, because the concentration of electrical discharge was observed … More by single wire and multi-power supply system. Therefore, we investigated the simultaneous pulse system, in which all pulses were generated at the same time. This simultaneous pulse system lead to better processing results compared to ISO pulse system.In the last year (FY2004), we the improved newly developed multi-wire EDM slicing equipment and investigated its characteristics. Stable processing could be realized by the changing conductivity pieces position, newly setting of wire sub-guide and the improvement of working fluid supplying method. It was cleared that better kerf shape was obtained with increasing the wire speed, and better machined surface was also obtained by controlling electrical discharge condition properly. Moreover, removal rate with three wire electrodes was equal to that with single wire electrode, and kerf shapes also were good. Therefore, it was confirmed that the multi-wire EDM method has the possibility of high efficiency and high accuracy slicing method for monocrystalline silicon ingot by using the new equipment developed in this study. Less