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Probe station for microelectronic systems

Probe station for microelectronic systems
微电子系统探针台
批准号:
459588797
负责人:
金额:
$0.0万
依托单位国家:
德国
项目类别:
Major Research Instrumentation
财政年份:
2021
资助国家:
德国
项目状态:
未结题
起止时间:
2020-12-31 至 --

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中文摘要
翻译
申请人小组处理微电子系统和电路的高效和紧凑的电源供应,也被称为电源管理。这些系统可以完全集成在一个微芯片上(片上系统),也可以部分地与外部无源元件集成在一个封装中(片上系统)。输入电压范围从几毫伏(在能量收集的情况下)到几伏特(在低压电池的情况下)和远超过50V。电压升高的趋势是为了减小转换损耗。因此,数据中心的服务器使用48V的中间电压。同样,混合动力和电动汽车除了传统的12v板网和400v高压电池外,还配备了48v电池,为传动系统供电。申请人小组多年来一直在集成高压电路这一领域进行研究。测量设备可以区分更高的电压等级(>50V至200V,未来可达600V及以上(GaN,电源模块))和低于50V的电压,包括高达5V的传统半导体技术。为了减少接触电阻、漏感、电容耦合等引起的寄生效应,通常将微芯片直接安装在印刷电路板上,直接键合。此外,需要对直径达200mm的整片晶圆进行表征,其中包含大量芯片。所有这些情况都将由大型设备覆盖,其基础是高压探头站,并辅之以高压SMU的参数分析仪,高达200V的CV单元,10MHz和电流<1fA的前置放大器,包括在“高压”和CV之间切换的开关单元。该设备包括一个双色激光切割机和一个温度高达200°C的热卡盘。
英文摘要
The applicant group deals with microelectronic systems and circuits for highly efficient and compact power supplies, also known as power management. The systems can be fully integrated on a microchip (System-on-Chip) or partially integrated with external, usually passive components in one package (System-in-Package). The input voltages range from a few millivolts (in case of energy harvesting) to a few volts (in case of low voltage batteries) and well over 50V. The trend towards higher voltages follows the need to minimize conversion losses. For this reason, servers in data centers use an intermediate voltage of 48V. Similarly, hybrid and electric cars are equipped with a 48 V battery in addition to the conventional 12 V board net and the 400 V high-voltage battery that supplies the drive train. The applicant group has been conducting research in this area, integrated high-voltage circuits, for many years. The measurement equipment can be distinguished between higher voltages classes (>50V to 200V, in future up to 600V and above (GaN, power modules)) and voltages below 50V including conventional semiconductor technologies for voltages up to 5V. In order to reduce parasitic effects caused by contact resistance, leakage inductance, capacitive coupling, etc., the microchips are often directly mounted on to the printed circuit board and directly bonded. Furthermore, the characterization of whole wafers up to 200mm diameter with a large number of chips is required. All these cases are to be covered by the large-scale equipment, the basis of which is a high-voltage probe station, which is supplemented by a parameter analyzer with high-voltage SMU, CV unit up to 200V, 10MHz and preamplifier for currents <1fA including switching unit for switching between "high voltage" and CV. The equipment includes a two-color laser cutter and a thermal chuck up to 200°C.
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