Probe station for microelectronic systems

微电子系统探针台

• 批准号: 459588797
• 金额: --
• 依托单位: Gottfried Wilhelm Leibniz Universität Hannover
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2021
• 资助国家: 德国
• 起止时间: 2020-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/459588797?language=en
• 关键词: Probe; station; microelectronic; systems

The applicant group deals with microelectronic systems and circuits for highly efficient and compact power supplies, also known as power management. The systems can be fully integrated on a microchip (System-on-Chip) or partially integrated with external, usually passive components in one package (System-in-Package). The input voltages range from a few millivolts (in case of energy harvesting) to a few volts (in case of low voltage batteries) and well over 50V. The trend towards higher voltages follows the need to minimize conversion losses. For this reason, servers in data centers use an intermediate voltage of 48V. Similarly, hybrid and electric cars are equipped with a 48 V battery in addition to the conventional 12 V board net and the 400 V high-voltage battery that supplies the drive train. The applicant group has been conducting research in this area, integrated high-voltage circuits, for many years. The measurement equipment can be distinguished between higher voltages classes (>50V to 200V, in future up to 600V and above (GaN, power modules)) and voltages below 50V including conventional semiconductor technologies for voltages up to 5V. In order to reduce parasitic effects caused by contact resistance, leakage inductance, capacitive coupling, etc., the microchips are often directly mounted on to the printed circuit board and directly bonded. Furthermore, the characterization of whole wafers up to 200mm diameter with a large number of chips is required. All these cases are to be covered by the large-scale equipment, the basis of which is a high-voltage probe station, which is supplemented by a parameter analyzer with high-voltage SMU, CV unit up to 200V, 10MHz and preamplifier for currents <1fA including switching unit for switching between "high voltage" and CV. The equipment includes a two-color laser cutter and a thermal chuck up to 200°C.

申请者小组处理高效和紧凑电源的微电子系统和电路，也称为电源管理。这些系统可以完全集成在微芯片上(片上系统)，也可以与外部的、通常是无源组件部分集成在一个封装中(封装中的系统)。输入电压的范围从几毫伏(在能量收集的情况下)到几伏(在低电压电池的情况下)，并远远超过50V。更高电压的趋势伴随着最小化转换损耗的需要。因此，数据中心的服务器使用48V的中间电压。同样，混合动力和电动汽车除了传统的12V板网和为传动系提供动力的400V高压电池外，还配备了48V电池。申请小组多年来一直在这一领域进行研究，即集成高压电路。测量设备可以区分较高电压等级(&gt；50V至200V，未来最高可达600V及以上(GaN、电源模块))和50V以下的电压(包括传统半导体技术，最高可达5V)。为了减少接触电阻、漏感、电容耦合等引起的寄生效应，微芯片通常直接安装在印刷电路板上，直接键合。此外，还需要对直径达200 mm的带有大量芯片的整个晶片进行表征。所有这些情况都将由大型设备涵盖，其基础是高压探针站，辅以带有高压SMU的参数分析仪、高达200V、10 MHz的CV单元和电流前置放大器&lt；1fA，包括用于在“高压”和CV之间切换的开关单元。该设备包括一个双色激光切割机和一个高达200°C的热卡盘。