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Development of mechanical micro-fabrication system using pencil-shape electroformed tool

Development of mechanical micro-fabrication system using pencil-shape electroformed tool
使用铅笔形电铸工具开发机械微加工系统
批准号:
13450061
负责人:
FUJIYAMA Hirokazu
金额:
$6.78万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2001
资助国家:
日本
项目状态:
已结题
起止时间:
2001 至 2003

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中文摘要
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英文摘要
Development of mechanical microfabrication system using microgrinding was made for the purpose to fabricate 3-dimensional micro dies and molds that could not be fabricated by the conventional techniques, such as LIGA technology and Micro Electro mechanical System MEMS. During last 2 years, the following 3 research projects were conducted.(1)Development of high-speed electroforming technique that can produce electroformed diamond tool with superior bending strength,(2)Development of micro truing and dressing techniques that can fabricate electroformed diamond tool to pencil-shape microgrinding tool under 0.1 mm diameter,(3)Fabrication of 2 and 3 dimensional micro-sized dies and molds using pencil-shape microgrinding tool and ultraprecision machining center.The results obtained could be summarized as follows;(1)Nickel/phosphorous plating technique that can produce an electroformed diamond tool processing the same bending strength with the conventional, cemented carbide tool could be successfully developed.(2) Micro truing and dressing techniques that can fabricate the tool end of the microgrinding tool to spherical and wedge shape could be developed using electroformed diamond tool from #3000 to #8000 in diamond mesh size.(3)It was verified from the grinding test that the microgrinding tool could be adapted to the fabrication of 2 and 3 dimensional micro structures, such as micro-reflectors, micro-reactors and micro-prism arrays.
期刊论文(48)
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科研奖励(0)
会议论文
仙波卓弥, 佐伯智之: "高集中度・電鋳工具製造技術の開発とマイクロ研削陽工具への応用"日本機械学会論文集C編. 70-694(印刷中 6月掲載). (2004)
Takuy​​a Senba、Tomoyuki Saeki:“高浓度电铸工具制造技术的开发及其在微磨削正向工具中的应用”,日本机械工程师学会汇刊,C 版(目前正在印刷,六月出版)。 (2004)
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通讯作者:
Takuya SEMBA, Yutaka KASA: "Development of High-Speed Ni/P Electroforming Technique for Fabricating Microgrinding Tool."Transaction of the Japan Society of Mechanical Engineers. Vol.70-No.694, (in press),C. (2004)
Takuy​​a SEMBA、Yutaka KASA:“用于制造微磨削工具的高速 Ni/P 电铸技术的开发”。日本机械工程师学会汇刊。
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H.Fujiyama, T.Sumomogi, T.Endo: "Effect of O_2 gas partia pressure on mechanical properties of SiO_2 films deposited by radion frequency magnetron sputtering"J.Vac.Sci.Technol.A. 20・2. 356-361 (2002)
H.Fujiyama、T.Sumomogi、T.Endo:“O_2 气体分压对射频磁控溅射沉积的 SiO_2 薄膜机械性能的影响”J.Vac.Sci.Technol.A 20・2。 2002)
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Takuya SEMBA, Hiroki HIGA, Brian J Stone: "Surface Texturing Using Grinding with Ultrasonic Longitudinal Vibration."Transaction of the Japan Society of Mechanical Engineers. Vol.69-No.681,C. 243-248 (2003)
Takuy​​a SEMBA、Hiroki HIGA、Brian J Stone:“使用超声波纵向振动研磨进行表面纹理化。”日本机械工程师学会汇刊。
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