Development of ESPI camera for diagnosis of material degradation

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Electronic Speckle Pattern Interferometry (ESPI) is a promising experimental technique whole-field deformation analysis. The technique has been developed to make possible to observe dynamic feature of deformation which we call dynamic ESPI (DESPI). In this report, at first, (1)development of dynamic ESPI (DESPI) for diagnosis of material degradation is present. (2)To evaluate degradation, field theoretical interpretation based on physical meso-mechanics is introduced. It is important to investigate dynamic behavior of plastic deformation process. (3)Newly proposed DESPI makes possible to investigate entire process of whole field deformation. (4)In tensile experiments of aluminum alloy samples and stainless steal samples, we found characteristics strain localization which propagate on the samples. (5)Quantitative analysis of speckle fringes are also presented. (6)A compact DESPI camera was designed and produced and fatigue process were investigated. (7)The proposed method, which is non-contact method, was applied to investigate moving feature of bio-objects such like growing state of a plant. (8)Further more the proposed method was progressed to investigate deformation of microscopic object. Micro-DESPI was applied to diagnose moving feature of MEMS. (9)Finally future expectation will be presented.