EFFECT OF CUTTING EDGE SHAPE OF DIAMOND ABRASIVE GRAIN ON DUCTILE MODE GRINDING OF OPTICAL BRITTLE MATERIAL
金刚石磨粒切削刃形状对光学脆性材料延性磨削的影响
基本信息
- 批准号:17560087
- 负责人:
- 金额:$ 1.92万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (C)
- 财政年份:2005
- 资助国家:日本
- 起止时间:2005 至 2006
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
1) SD46 diamond abrasive grain has a cutting edge of which negative rake angles are distributed from 35 to 90 degrees. The critical depth of cut which realizes the ductile-mode cutting of borosilicate glass depends on the cutting edge rake angle and decreases from 160 run to 60 nm with an increase in the negative rake angle. The critical depth of cut in the case of cup-cutting is 10 nm larger than that in the case of down-cutting.2) Nano-indentation was conducted for various kinds of optical materials and the elastic and/or plastic behaviors were investigated as well as the brittle behavior in terms of the type of indenter and the indentation load. It was found that the maximum elastic deformation achieved by the Vickers-type indenter is larger than that achieved by the sphere-type indenter when the indentation load is the same. The indentation load at which a crack caused by brittle fracture occurs is larger in the case of Vickers-type indenter than that in the case of sphere-type indenter.3) The effect of cutting edge truncation on the surface plunge grinding was investigated by means of Monte Carlo simulation. It was found that the maximum grain depth of cut decreases with a progress of cutting edge truncation and converges to a constant value determined by the abrasive grain size and the grinding wheel concentration.4) The surface plunge grinding experiments of glass quartz were conducted and it was found that the ground surface roughness is significantly improved by the cutting edge truncation; however, a smaller wheel depth of cut and a slower workpiece speed should be selected in order to achieve the ductile-mode grinding.
1)SD 46金刚石磨粒具有负前角分布在35度至90度的切削刃。实现硼硅酸盐玻璃延性切削的临界切削深度取决于切削刃前角,随着负前角的增大,临界切削深度从160 nm减小到60 nm。杯形切削的临界切削深度比下切的临界切削深度大10 nm。2)对不同光学材料进行了纳米压痕实验,研究了不同压头类型和压痕载荷下材料的弹性和/或塑性行为以及脆性行为。结果表明,在相同压痕载荷下,维氏压头的最大弹性变形大于球形压头的最大弹性变形。Vickers型压头比球型压头产生脆性断裂时的压痕载荷更大。3)采用Monte Carlo模拟方法研究了刃口截短对切入磨削的影响。结果表明,最大切削深度随刃口截短的进行而减小,并收敛于一个由磨粒尺寸和砂轮浓度决定的定值。4)对石英玻璃进行了平面切入磨削实验,发现刃口截短能显著改善磨削表面粗糙度;然而,为了实现延性模式磨削,应选择较小的砂轮切削深度和较慢的工件速度。
项目成果
期刊论文数量(8)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices
切削刃截断对光学器件用硬脆材料磨削表面形貌的影响
- DOI:
- 发表时间:2005
- 期刊:
- 影响因子:0
- 作者:X.Kang;J.Tamaki;A.Kubo;J.Yan
- 通讯作者:J.Yan
Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials
- DOI:10.1504/ijmtm.2006.009995
- 发表时间:2006-06
- 期刊:
- 影响因子:0
- 作者:X. Kang;J. Tamaki;A. Kubo
- 通讯作者:X. Kang;J. Tamaki;A. Kubo
光学ガラスの延性モード研削性能に及ぼすダイヤモンド砥粒切れ刃形状の影響
金刚石磨料切削刃形状对光学玻璃延性磨削性能的影响
- DOI:
- 发表时间:2005
- 期刊:
- 影响因子:0
- 作者:田牧純一;佐藤元;前川公貴;閻紀旺;久保明彦
- 通讯作者:久保明彦
EFFECT OF CUTTING EDGE OF DIAMOND ABRASIVE GRAIN ON DUCTILE MODE GRINDING OF OPTIC GLASS
金刚石磨粒切削刃对光学玻璃延性磨削的影响
- DOI:
- 发表时间:2005
- 期刊:
- 影响因子:0
- 作者:J.TAMAKIT;G.SATO;K.MAEKAWA;J.YAN;A.KUBO
- 通讯作者:A.KUBO
{{
item.title }}
{{ item.translation_title }}
- DOI:
{{ item.doi }} - 发表时间:
{{ item.publish_year }} - 期刊:
- 影响因子:{{ item.factor }}
- 作者:
{{ item.authors }} - 通讯作者:
{{ item.author }}
数据更新时间:{{ journalArticles.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ monograph.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ sciAawards.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ conferencePapers.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ patent.updateTime }}
KUBO Akihiko其他文献
KUBO Akihiko的其他文献
{{
item.title }}
{{ item.translation_title }}
- DOI:
{{ item.doi }} - 发表时间:
{{ item.publish_year }} - 期刊:
- 影响因子:{{ item.factor }}
- 作者:
{{ item.authors }} - 通讯作者:
{{ item.author }}
相似海外基金
High Efficient and High Quality Machining of Optical Glass by Ductile Mode Grinding
延性模式磨削光学玻璃的高效、高质量加工
- 批准号:
13650788 - 财政年份:2001
- 资助金额:
$ 1.92万 - 项目类别:
Grant-in-Aid for Scientific Research (C)














{{item.name}}会员




