High Efficient and High Quality Machining of Optical Glass by Ductile Mode Grinding

延性模式磨削光学玻璃的高效、高质量加工

• 批准号: 13650788
• 负责人: SUMOMOGI Tsunetaka
• 金额: $ 2.11万
• 依托单位: Hiroshima Kokusai Gakuin University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650788/
• 关键词: nano-scale machining; ductile mode machining; optical glass; ductile-brittle transition; surface crack; subsurface crack; scanning force microscope; scanning laser microscope

The studies on nano-scale machining of brittle materials, such as silicon and glass, have come into notice in recent years. A material removal with plastic deformation, known as ductile mode machining, has been achieved by a very small depth of cut. When surface cracks occurred with being increased the depth of cut, the machining has been commonly considered to be brittle mode. The workpiece material used in the present experiment is a optical glass (BK7). A single crystal Vickers diamond pyramid indentor with an apex angle of 136° is used as the cutting tool. The ultra precision turning machine consists of an aerostatic bearing spindle for workpiece revolution and a roller bearing slide for tool feed. Face-turning of the workpiece is done from the center to the outside with a constant cutting speed between 150 m/min and 1500 m/min and a constant feed rate of 0.03 mm/revolution, and a spiral groves are formed. An inclination is given to the mounted workpiece by a partly inserted spacer … More between the workpiece and the chuck surface in order to generate various depth of grooves. The ductile-brittle transition points are examined by the observations not only on the surface cracks but also on the subsurface cracks. A scanning force microscope is used for measuring the depth of the grooves and observing the surface cracks. The distance from the surface to the deepest point of the subsurface crack on obliquely sectioned and then etched surfaces are measured by a scanning laser microscope. The subsurface cracks are generated at a depth of a few nm, while the transition point based on the surface crack would be a depth of 400-700nm. The surface crack on optical glass expands suddenly over the transition point, while the surface crack on single crystal silicon expands gradually. It is detected that the ductile-brittle transition point determined by the subsurface cracks is shallower than that determined by the surface cracks. Therefore the evaluation of the subsurface cracks would be important especially in finishing, Less

硅、玻璃等脆性材料的纳米加工研究近年来引起了人们的关注。一个材料去除与塑性变形，被称为延性模式加工，已实现了一个非常小的切削深度。当表面裂纹随着切削深度的增加而产生时，通常认为切削是脆性的。本实验中使用的工件材料是光学玻璃（BK 7）。使用顶角为136°的单晶维氏金刚石棱锥压头作为切削工具。超精密车床由一个用于工件旋转的空气静压轴承主轴和一个用于刀具进给的滚柱轴承滑块组成。以150 m/min和1500 m/min之间的恒定切削速度和0.03 mm/转的恒定进给速率从中心向外完成工件的端面车削，并形成螺旋格罗夫斯。通过部分插入的垫片使安装的工件倾斜 ...更多信息 在工件和卡盘表面之间，以产生各种深度的凹槽。通过对表面裂纹和亚表面裂纹的观察，确定了韧脆转变点。用扫描力显微镜测量了沟槽的深度并观察了表面裂纹。从表面到最深点的距离的表面上的倾斜切片，然后蚀刻表面上的亚表面裂纹是由扫描激光显微镜测量。亚表面裂纹在几nm的深度处产生，而基于表面裂纹的转变点将是400- 700 nm的深度。光学玻璃表面裂纹在过渡点处突然扩展，而单晶硅表面裂纹则逐渐扩展。结果表明，亚表面裂纹所决定的韧脆转变点比表面裂纹所决定的韧脆转变点要浅。因此，对表面下裂纹的评估将是非常重要的，特别是在精加工中，

项目成果

T.Sumomogi et al.: "Simultaneous evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope"Proceedings of the Euspen 2nd International Conference, May 27-31, 2001, Turin

T.Sumomogi 等人：“通过扫描力显微镜和扫描激光显微镜对纳米级加工脆性材料的表面和次表面裂纹进行同步评估”Euspen 第二届国际会议记录，2001 年 5 月 27-31 日，都灵

T.Sumomogi et al.: "Evaluation of surface and subsurface cracks in nanoscale-machined single-crystal silicon by scanning force microscope and scanning laser microscope"Materials Characterization. 48. 129-123 (2002)

T.Sumomogi 等人：“通过扫描力显微镜和扫描激光显微镜评估纳米级加工的单晶硅的表面和次表面裂纹”材料表征。

T. Sumomogi, M. Nakamura and T. Endo: "Simultaneous evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope"Proceedings of the Euspen 2nd International Conference. May

T. Sumomogi、M. Nakamura 和 T. Endo：“通过扫描力显微镜和扫描激光显微镜同时评估纳米级加工脆性材料的表面和次表面裂纹”Euspen 第二届国际会议论文集。

M.Yoshida, M.Nakamura, T.Sumomogi et al.: "Nanoindentation Study of Ultra High Purity Aluminum"Bulletin of Hiroshima Kokusai Gakuin Universitya. 35. 39-49 (2002)

M.Yoshida、M.Nakamura、T.Sumomogi 等：“超高纯铝的纳米压痕研究”广岛国际学院大学通报a。

M. Nakamura, T. Sumomogi and T. Goto: "Study on ductile mode grinding of brittle materials using single abrasive grain"Proceedings of JSME/ASME International Conference on Materials and Processing. October 15-18, 2002, Honolulu. 601-604

M. Nakamura、T. Sumomogi 和 T. Goto：“使用单一磨粒对脆性材料进行延性模式磨削的研究”JSME/ASME 国际材料与加工会议论文集。