ダイヤモンドマイクロアレイ工具の創成と極微細加工に関する研究

在这项研究中，我们开发了一种用于微纳米加工的金刚石微铣刀。该工具是通过将金刚石切削刃附着在旋转轴的尖端来制造的。在单晶硅各向异性湿法蚀刻或反应离子蚀刻的硅模上，利用CVD沉积多晶金刚石，制备出形状各异的金刚石切削刃，称为“金刚石阵列刀具”。刃口形状多种多样，前者为金字塔形，后者为方形、半圆形、三角形、梯形等。利用该微铣刀对单晶硅、金属玻璃和丙烯酸树脂进行加工，通过扫描电镜观察到这些材料的切屑。结果表明，微铣刀可以实现高效率、高精度的加工。

In this study, we developed a diamond micro milling tool for micro-to-nano scale machining. This tool is manufactured by attaching a diamond cutting edge to tip of rotational axis. The diamond cutting edge with various shapes named "diamond array tool" are fabricated by depositing polycrystalline diamond using CVD on silicon molds which are made by anisotropic wet etching of the single crystal silicon or by reactive ion etching. The cutting edge has various shapes, the former is pyramidal, the latter are square, semicircle, triangle and trapezoid etc. By using this micro milling tool to machining for single crystal silicon, metallic glass and acrylic resin, the chip of these materials was observed largely by SEM image. It was found that the micro milling tool was possible to machining with high efficiency and accuracy.