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Evaluation of the effects of residual stress occurred and hydrogen co-deposited during tin electroplating on the suppression and growth of tin whisker

Evaluation of the effects of residual stress occurred and hydrogen co-deposited during tin electroplating on the suppression and growth of tin whisker
电镀锡过程中残余应力和氢共沉积对锡晶须抑制和生长影响的评价
批准号:
17560637
负责人:
TSURU Yutaka
金额:
$1.09万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2005
资助国家:
日本
项目状态:
已结题
起止时间:
2005 至 2006

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TSURU Yutaka的其他基金

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中文摘要
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英文摘要
Effects of the electroplating bath temperature on the growth of whisker from tin film electroplated from an acid tin sulfate bath were investigated. Brass was used as the plating substrate, since brass always accelerated the growth of tin-whisker compared with the other metals. Tin electroplating was performed at seven kinds of bath temperature such as 0℃, 5℃, 10℃, 15℃ 20℃, 25℃ and 50℃. The internal stress always changed from tension at the beginning of electrolysis to compression with successive electroplating of tin. The compressive stress in as-deposited tin film decreased with increasing in bath temperature. The residual stress in tin film deposited at 50℃ was almost zero. The higher the bath temperature was, the larger the granular size of deposited tin became and the current efficiency for tin deposition increased. The growth of tin-whisker was enhanced in temperature orders of O℃>5℃>10℃>15℃>20℃>25℃>50℃.The Influences of tin-zinc alloy formation on tin whisker growth out of the e … More lectroplated tin was also investigated. The substrate of specimen was aluminum sheet with one-side chemically plated zinc and the reverse side insulated electrically by a plastic resin on it. Tin was electroplated on the zinc film. The aluminum sheet with the plated tin deposits was put in the incubator controlled thermostatically at 50℃ for the purpose of accelerating tin whisker growth. After some tin whisker grew, the specimen with tin whisker was covered by nickel electroformed from a nickel sulfamate bath. The plastic resin was stripped off for exposing the other-side aluminum, which was immersed and corroded in 1.0 moldm^<-3> NaOH solution at 25℃ and the corrosion potential was measured.Only the corrosion potentials concerning the zinc and tin electrode were detected for the specimen before tin whisker occurred. On the other hand, the specimen with some tin whisker always showed the corrosion potentials concerning tin-zinc alloy except the corrosion potential of tin and zinc, respectively. Such results suggested that zinc diffused into the plated tin to form tin-zinc alloy, which resulted in tin whisker growth. Less
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DOI: --
发表时间: 2007
期刊: 電気化学会第74回大会講演要旨集 74
影响因子: --
作者: [津留 豊, 中尾貴裕]
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Snウィスカ発生に及ぼすZn-Sn合金層形成の影響
Zn-Sn合金层的形成对Sn晶须产生的影响
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发表时间: 2008
期刊: 表面技術協会第117回講演大会要旨集 13B-9
影响因子: --
作者: [村上 宏子, 上森 圭, 岡本 孝三, 津留 豊]
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DOI: --
发表时间: 2007
期刊: 表面技術協会第116回講演大会 19B-25
影响因子: --
作者: [上森 圭, 村上 宏子, 津留 豊]
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Effects of Zinc Diffusion into Electroplated Tin Film on Growth of Tin Whisker
锌扩散到电镀锡膜中对锡晶须生长的影响
DOI: --
发表时间: 2008
期刊: Proceedings of 117th Conference of the Surface Finishing Society of Japan(Nihon University) 13B-8
影响因子: --
作者: [Kei Uemori, Hiroko Murakami, Yutaka Tsuru]
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20
    Metal joining between two pieces of aluminum rods by precision electroforming at room temperature and evaluation of their adhesion strength.
    • 批准号:
      14550705
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $1.34万
    • 财政年份:
      2002
    • 负责人:
      TSURU Yutaka
    • 依托单位: