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Evaluation of the effects of residual stress occurred and hydrogen co-deposited during tin electroplating on the suppression and growth of tin whisker

电镀锡过程中残余应力和氢共沉积对锡晶须抑制和生长影响的评价

基本信息

批准号：
17560637
负责人：
TSURU Yutaka
金额：
$ 1.09万
依托单位：
Kyushu Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2005
资助国家：
日本
起止时间：
2005 至 2006
项目状态：
已结题

项目摘要

Effects of the electroplating bath temperature on the growth of whisker from tin film electroplated from an acid tin sulfate bath were investigated. Brass was used as the plating substrate, since brass always accelerated the growth of tin-whisker compared with the other metals. Tin electroplating was performed at seven kinds of bath temperature such as 0℃, 5℃, 10℃, 15℃ 20℃, 25℃ and 50℃. The internal stress always changed from tension at the beginning of electrolysis to compression with successive electroplating of tin. The compressive stress in as-deposited tin film decreased with increasing in bath temperature. The residual stress in tin film deposited at 50℃ was almost zero. The higher the bath temperature was, the larger the granular size of deposited tin became and the current efficiency for tin deposition increased. The growth of tin-whisker was enhanced in temperature orders of O℃>5℃>10℃>15℃>20℃>25℃>50℃.The Influences of tin-zinc alloy formation on tin whisker growth out of the e … More lectroplated tin was also investigated. The substrate of specimen was aluminum sheet with one-side chemically plated zinc and the reverse side insulated electrically by a plastic resin on it. Tin was electroplated on the zinc film. The aluminum sheet with the plated tin deposits was put in the incubator controlled thermostatically at 50℃ for the purpose of accelerating tin whisker growth. After some tin whisker grew, the specimen with tin whisker was covered by nickel electroformed from a nickel sulfamate bath. The plastic resin was stripped off for exposing the other-side aluminum, which was immersed and corroded in 1.0 moldm^<-3> NaOH solution at 25℃ and the corrosion potential was measured.Only the corrosion potentials concerning the zinc and tin electrode were detected for the specimen before tin whisker occurred. On the other hand, the specimen with some tin whisker always showed the corrosion potentials concerning tin-zinc alloy except the corrosion potential of tin and zinc, respectively. Such results suggested that zinc diffused into the plated tin to form tin-zinc alloy, which resulted in tin whisker growth. Less

研究了镀液温度对酸性硫酸锡镀液中TiN薄膜晶须生长的影响。采用黄铜作为电镀基材，与其他金属相比，黄铜总能促进锡晶须的生长。在0℃、5℃、10℃、15℃20℃、25℃和50℃7种镀液温度下进行镀锡。随着连续电镀TiN的进行，内应力始终由电解初期的拉应力转变为压缩应力。镀态TiN薄膜的压应力随镀液温度的升高而降低。当沉积温度为50℃时，TiN薄膜的残余应力几乎为零。镀液温度越高，沉积的TiN颗粒越大，TiN沉积的电流效率越高。锡晶须的生长按O℃&gt；5℃&gt；10℃&gt；15℃&gt；20℃&gt；25℃&gt；50℃.The的温度顺序得到促进。锡锌合金的形成对…外锡晶须生长的影响还对更多的电镀锡进行了研究。试件的基材为铝板，单面镀锌，背面用塑料树脂绝缘。在锌膜上电镀锡。为了加速锡须的生长，将镀锡层的铝板放入恒温控制在50℃的恒温箱中。在一些锡晶须生长后，在锡晶须的试件上覆盖一层从氨基磺酸镍溶液中电铸的镍。剥离塑料树脂暴露另一侧的铝材，在25℃的1.0moldm；lt；-3&gt；NaOH溶液中浸泡和腐蚀，测量腐蚀电位。在锡须出现之前，只检测到锌和锡电极的腐蚀电位。而含少量锡晶须的试样，除锡和锌的腐蚀电位外，其余均表现出锡锌合金的腐蚀电位。这些结果表明，锌扩散到镀锡中形成锡锌合金，从而导致锡晶须的生长。较少