Metal joining between two pieces of aluminum rods by precision electroforming at room temperature and evaluation of their adhesion strength.
Metal joining between two pieces of aluminum rods by precision electroforming at room temperature and evaluation of their adhesion strength.
批准号:
14550705
负责人:
TSURU Yutaka
金额:
$1.34万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2003
中文摘要
我们在房间温度下制造了两块铝棒(A1070 BD-H14),以精确的电化学结合在一起。锌或镍在其铝棒的接触边界区域上的电在以前被机械附着的情况下得到了性能。在电池的电形成和子序列探测之后,铝和电平板薄膜之间的粘附强度通过张力测试进行了评估。氧化物薄膜形成的天然存在于铝表面上,导致在电镀薄膜和铝基底之间的弱粘合剂。因此,在商业电子网格纸上机械地分解后,由于对它们的粘合强度的改进,我们应用了化学铝/锌替代过程,使用锌溶液来防止氧化物薄膜的形成。zincates solution was 5.0 g/dm^3 ZnO - 120 g/dm^3 NaOH - 2.0 g/dm ^3 FeCl_3·6 H_2 O-50 g/dm^3 C_4 H_4 NaKO_6·4 H_2 O- 1.0 g/dm^3 NaNO_3.As a result, it confirmed that electroforming was an excellent method for joaluminum metals each other at room temperature。通过锌酸盐治疗、机械加工过程中的化学表面完成,也极大地影响了锌或镍金属薄膜的铝和电镀强度之间的粘合强度。例如,最强的吸附强度在随后的化学表面完成过程中产生,第一次搅拌过程在90秒内产生,然后蚀刻过程在36卷中产生。%HMO_3在60秒内成功2^<nd>搅拌过程。在另一只手上,我们在#1000之前通过商业电子网格文件找到了机械磨损,在一个类似的Zincation过程中总是大大提高了他们在张力测试中的粘合剂强度。
英文摘要
We made two pieces of aluminum rods (A1070BD-H14) join by precision electroforming at room temperature. The electroforming of zinc or nickel on the contact boundary regions of their aluminum rods was performed after previously mechanical attaching by a bolt. After electroforming and subsequent detaching of the bolt, the adhesion strength between the aluminum and electroplating films was evaluated by tension tests. The oxide film formed spontaneously on aluminum surface caused weak adhesion between electroplating film and aluminum substrate. Therefore, after mechanically abrasion by commercial emery grid paper, for the improvement of their adhesion strength we applied a chemical Al/Zn substitution process using zincates solution to prevent formation of the oxide film. The composition of the zincates solution was 5.0 g/dm^3 ZnO - 120 g/dm^3 NaOH - 2.0 g/dm^3 FeCl_3・6H_2O -50 g/dm^3C_4H_4NaKO_6・4H_2O - 1.0 g/dm^3NaNO_3.As a result, it confirmed that electroforming was an excellent method for joining aluminum metals each other at room temperature. Beside of the chemical surface finishing by the zincates treatment, the mechanical abrasion process also influenced greatly on the adhesion strength between the aluminum and electroplating metal films of zinc or nickel. For example, the strongest adhesion strength was carried out in the following chemical surface finishing process, first zincates process for 90 seconds and then etching process by 36 vol. % HMO_3 for 60 seconds and succeeding 2^<nd> zincates process for 30 seconds. On the other hand, we found that the mechanical abrasion by commercial emery grid paper of #1000 before a similar zincates process always improved greatly their adhesion strengths in tension tests.
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Effects of Surface Finishing of Aluminum Plates on the Adhesion Strength between the Aluminum Substrate and Electroplated Film by Peeling Test
通过剥离试验研究铝板表面处理对铝基板与电镀膜附着力的影响
DOI:
--
发表时间:
2005
期刊:
Proceedings of 111^<th> Conference of the Surface Finishing Society of Japan 16B-8
影响因子:
--
作者:
[Kouzou Okamoto, Yutaka Tsuru]
通讯作者:
Yutaka Tsuru
岡本孝三, 松尾仁志, 津留 豊: "ニッケルめっきの密着強度に及ぼすアルミニウム表面処理の影響"表面技術協会第109回講演大会講演要旨集. 109. 196-196 (2004)
Kozo Okamoto、Hitoshi Matsuo、Yutaka Tsuru:“铝表面处理对镀镍附着强度的影响”表面技术协会第 109 届会议摘要 109. 196-196 (2004)。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
ニッケルめっき膜の密着強度に及ぼすアルミニウム表面処理の影響
铝表面处理对镀镍膜结合强度的影响
DOI:
--
发表时间:
2004
期刊:
表面技術協会第109回講演大会要旨集
影响因子:
--
作者:
[岡本孝三, 松尾仁志, 津留豊]
通讯作者:
津留豊
ニッケルめっき膜の密着強度に及ぼす膜物性とアルミニウム素地表面処理の影響
镀膜性能及铝基体表面处理对镀镍膜结合强度的影响
DOI:
--
发表时间:
2004
期刊:
表面技術協会第110回講演大会要旨集
影响因子:
--
作者:
[津留豊, 小柳仁, 岡本孝三]
通讯作者:
岡本孝三
Effects of Surface Finishing of Aluminum Rods on the Adhesion Strength between the Aluminum Substrate and Electroplated Nickel Film by Tension Test
拉力试验研究铝棒表面处理对铝基体与电镀镍膜结合强度的影响
DOI:
--
发表时间:
2004
期刊:
Proceedings of 110^<th> Conference of the Surface Finishing Society of Japan 13A-4
影响因子:
--
作者:
[Yutaka Tsuru, Hitoshi Koyanagi, Kouzou Okamoto]
通讯作者:
Kouzou Okamoto
共 10 条
Evaluation of the effects of residual stress occurred and hydrogen co-deposited during tin electroplating on the suppression and growth of tin whisker
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批准号:17560637
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项目类别:Grant-in-Aid for Scientific Research (C)
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资助金额:$1.09万
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财政年份:2005
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负责人:TSURU Yutaka
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依托单位: