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Soft Soldering of Carbon Materials after Metalizing

Soft Soldering of Carbon Materials after Metalizing
碳材料金属化后的软焊
批准号:
17560655
负责人:
FUKAYA Yasuhiro
金额:
$2.18万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2005
资助国家:
日本
项目状态:
已结题
起止时间:
2005 至 2006

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中文摘要
翻译
高密度石墨、玻璃炭复合材料、树脂烧结石墨等炭素材料将成为聚合物电解液燃料电池隔膜材料。但是,这些材料的粘结性能很差。对碳材料表面铜-银-钛金属化后的软钎焊进行了研究。主要研究结果如下:(1)在高密度石墨和树脂烧结石墨条件下,获得了无孔洞连接。(2)在上述两种石墨上获得的接头强度(四点弯曲强度)与基体石墨的弯曲强度相当。
英文摘要
Carbon materials such as high density graphite, glassy carbon composite, resin sintered graphite are going to apply for separater of Polymer Electrolyte Fuel Cell. But, bonding properties of these materials is very poor. Soft soldering (Sn-Pb) after Cu-Ag-Ti metalizing on carbon materials was studied in this research. Main results obtained are as follows.(1) Void free bonding joint is obtained at high density graphite and resin sintered graphite. But, Cu-Ag-Ti metalizing layer was peeled off at glassy carbon composite.(2) Joint strength (4 point bending strength) equivalent to bending strength of base graphite is obtained at above mentioned two graphites.
期刊论文(2)
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会议论文
Pb-Sn Soldering of High Density Graphite after Metalizing and Electric Plating -Study on Bonding of Carbon Materials (Report3)-
金属化电镀后高密度石墨的Pb-Sn焊接-碳材料的结合研究(报告3)-
DOI: --
发表时间: 2005
期刊: Preprints of the national meeting o f J.W.S. 77
影响因子: --
作者: [Hajimu Wakabayashi, Takahiko Honma, 若林 肇, Hajimu Wakhbayashi, 若林 肇, 深谷保博ほか3名, Fukaya Yasuhiro]
通讯作者: Fukaya Yasuhiro
表面改質層を介した等方性高密度黒鉛の大気中はんだろう付
各向同性高密度石墨表面改性层的常压钎焊
DOI: --
发表时间: 2005
期刊: 溶接学会全国大会講演概要 第77集
影响因子: --
作者: [Hajimu Wakabayashi, Takahiko Honma, 若林 肇, Hajimu Wakhbayashi, 若林 肇, 深谷保博ほか3名]
通讯作者: 深谷保博ほか3名
Bonding of Carbon Material by Sinter bonding with adhesive resin using direct current heating and pressing
  • 批准号:
    13650787
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 资助金额:
    $1.54万
  • 财政年份:
    2001
  • 负责人:
    FUKAYA Yasuhiro
  • 依托单位:
Bonding Ceramics to Metal by Discharged Plasma Heating
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