Soft Soldering of Carbon Materials after Metalizing

碳材料金属化后的软焊

• 批准号: 17560655
• 负责人: FUKAYA Yasuhiro
• 金额: $ 2.18万
• 依托单位: Kinki University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2005
• 资助国家: 日本
• 起止时间: 2005 至 2006
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-17560655/
• 关键词: Polymer Electrolyte Fuel Cell; Separater; Graphite; Carbon material; Bonding; Soft soldering; Metalizing; Bending strength

Carbon materials such as high density graphite, glassy carbon composite, resin sintered graphite are going to apply for separater of Polymer Electrolyte Fuel Cell. But, bonding properties of these materials is very poor. Soft soldering (Sn-Pb) after Cu-Ag-Ti metalizing on carbon materials was studied in this research. Main results obtained are as follows.(1) Void free bonding joint is obtained at high density graphite and resin sintered graphite. But, Cu-Ag-Ti metalizing layer was peeled off at glassy carbon composite.(2) Joint strength (4 point bending strength) equivalent to bending strength of base graphite is obtained at above mentioned two graphites.

高密度石墨、玻璃碳复合材料、树脂烧结石墨等碳材料有望应用于聚合物电解质燃料电池隔膜。但是，这些材料的粘结性能非常差。研究了碳材料表面Cu-Ag-Ti金属化后的软钎焊（Sn-Pb）。主要结果如下。(1)在高密度石墨和树脂烧结石墨上获得了无气孔的连接接头。但是，在玻璃碳复合材料上，Cu-Ag-Ti金属化层剥落。(2)在上述两种石墨上获得与基体石墨的弯曲强度相当的连接强度（4点弯曲强度）。

项目成果

Pb-Sn Soldering of High Density Graphite after Metalizing and Electric Plating -Study on Bonding of Carbon Materials (Report3)-

金属化电镀后高密度石墨的Pb-Sn焊接-碳材料的结合研究（报告3）-

• 发表时间: 2005
• 期刊: Preprints of the national meeting o f J.W.S. 77
• 作者: Hajimu Wakabayashi;Takahiko Honma;若林 肇;Hajimu Wakhbayashi;若林 肇;深谷保博ほか3名;Fukaya Yasuhiro
• 通讯作者: Fukaya Yasuhiro

表面改質層を介した等方性高密度黒鉛の大気中はんだろう付

各向同性高密度石墨表面改性层的常压钎焊

• 发表时间: 2005
• 期刊: 溶接学会全国大会講演概要 第77集
• 作者: Hajimu Wakabayashi;Takahiko Honma;若林 肇;Hajimu Wakhbayashi;若林 肇;深谷保博ほか3名
• 通讯作者: 深谷保博ほか3名