Bonding Ceramics to Metal by Discharged Plasma Heating

通过放电等离子加热将陶瓷与金属粘合

• 批准号: 10650723
• 负责人: FUKAYA Yasuhiro
• 金额: $ 1.34万
• 依托单位: The Faculty of Engineering, Kinki University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 1999
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-10650723/
• 关键词: Ceramic; AlィイD22ィエD2 OィイD23ィエD2; SiィイD23ィエD2 NィイD24ィエD2; Bonding; Crack; Residual stress; Discharged plasma; Diffusion bonding; 焼結接合

Crack propagates in ceramic when extensive residual stress generates in ceramic at joint of ceramic to metal. Low temperature and soft metal(Ag,Cu) inserted bonding are effective for reduction of residual stress. Discharged plasma heating is applied for low temperature bonding and Ag,Cu are used for soft metal inserted bonding. Boding test AlィイD22ィエD2 O ィイD23ィエD2 SiィイD23ィエD2 N ィイD24ィエD2 to γ-stainless steel by this proposed bonding was done. Main results obtained are as follows :(1) Crack propagates usually in ceramic at conventional bonding(Ag-Cu-Ti direct brazing).This crack was prevented perfectly by proposed bonding.(2) Residual stress in ceramic was analyzed by Thermo- elasto-plastic analysis by FEM. It was confirmed that residual stress in ceramic at conventional bonding was equivalent to strength of base ceramic and reduced to 23-50% by proposed bonding. It is assumed that prevention of crack is due to this reduction of residual stress in ceramic.(3) Joint strength of proposed bonding was investigated by 4-point bending test.Excellent strength was obtained.

在陶瓷与金属连接处，陶瓷内部产生较大的残余应力，裂纹在陶瓷中扩展。低温和软金属（Ag、Cu）插入连接是降低残余应力的有效方法。低温键合采用放电等离子体加热，软金属插入键合采用Ag、Cu。用该方法对Al_（22）Al_（23）Al_（22）Al_（23）Al_（22）Al_（23）Al_（24）主要研究结果如下：（1）在常规连接（Ag-Cu-Ti直接钎焊）中，裂纹通常在陶瓷中扩展，而本文提出的连接方法可以很好地防止裂纹的扩展。(2)采用有限元热弹塑性分析方法对陶瓷材料的残余应力进行了分析。据证实，陶瓷中的残余应力在传统的连接是相当的强度的基础陶瓷和减少到23-50%，建议的连接。据推测，裂纹的防止是由于陶瓷中的残余应力的减少。(3)通过四点弯曲试验研究了该复合材料的接头强度，得到了良好的接头强度。

项目成果

深谷保博ほか: "Ag,Cu薄膜ろう付とパルス通電加熱接合を併用したSi_3N_4とSUS304の接合"溶接学会全国大会講演概要. 第65集. 584-585 (1999)

Yasuhiro Fukaya 等人：“结合使用 Ag、Cu 薄膜钎焊和脉冲电流加热连接来连接 Si_3N_4 和 SUS304”，全国焊接学会会议上的演讲摘要，第 65 卷，第 584-585 卷（1999 年）。

深谷保博ほか: "Ag薄膜ろう付+放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合"溶接学会全国大会講演概要. 第63集. 360-361 (1998)

Yasuhiro Fukaya等人：“通过Ag薄膜钎焊+放电等离子体加热接合方法进行Al_2O_3/SUS304的残余应力松弛接合”日本焊接学会全国会议上的演讲摘要63. 360-361卷。

深谷保博ほか: "セラミックス/金属接合体における残留応力とセラミックスの割れ"日本機械学会第7回機械材料・材料加工技術講演会講演論文集. No99-23. 283-284 (1999)

Yasuhiro Fukaya 等人：“陶瓷/金属接头中的残余应力和陶瓷裂纹”日本机械工程师学会第七届机械材料和材料加工技术会议论文集第 283-284 号（1999 年）。

Y. Fukaya, etal.: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding after Ag Brazing."Preprints of the national meeting of J. W. S.. 63. 360-361 (1998)

Y. Fukaya 等人：“Ag 钎焊后通过放电等离子加热粘合来消除 AliD22D2 /SUS304 粘合接头的应力。”J. W. S. 全国会议预印本 63. 360 -361 (1998)

Y. Fukaya, etal: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding with Cu Powder after Cu Brazing"Preprints of the national meeting of J. W. S.. 63. 362-363 (1998)

Y. Fukaya 等人：“Cu 钎焊后通过放电等离子加热与 Cu 粉接合的 AliD22D2 O D23D2 /SUS304 接合接头的应力消除”J. W. S. 全国会议预印本 63. 362-363 (1998)