Bonding Ceramics to Metal by Discharged Plasma Heating
Bonding Ceramics to Metal by Discharged Plasma Heating
批准号:
10650723
负责人:
FUKAYA Yasuhiro
金额:
$1.34万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1998
资助国家:
日本
项目状态:
已结题
起止时间:
1998 至 1999
中文摘要
Crack propagates in ceramic when extensive residual stress generates in ceramic at joint of ceramicLow temperature and soft metal(Ag,Cu) inserted bonding are effective for reduction ofresidual stress. Discharged plasma heating is applied for low temperature bonding and Ag,Cu are usedfor soft metal inserted bonding. Boding test Al - D22 - D2 O - D23 - D2 Si - D23 - D2 N - D24 - D2 toγ-stainless steel by this proposed bonding was done. Main results obtained are as follows:(1) Crackpropagates usually in ceramic at conventional bonding(Ag-Cu-Ti direct brazing).This crack wasprevented perfectly by proposed bonding. 2 . Residual stress in ceramic was analyzed by Thermo-elasto-plastic analysis by FEM. It was conventional that residual stress in ceramic at conventionalbonding was equivalent to基本ceramic and reduced to 23-50% by proposed bonding.它是(3) Joint that prevention of crack is due to this residual stress in ceramic.(3) Joint4点bending test.Excellent strength was 4点bending test.Excellent strength wasobtained。
英文摘要
Crack propagates in ceramic when extensive residual stress generates in ceramic at joint of ceramic to metal. Low temperature and soft metal(Ag,Cu) inserted bonding are effective for reduction of residual stress. Discharged plasma heating is applied for low temperature bonding and Ag,Cu are used for soft metal inserted bonding. Boding test AlィイD22ィエD2 O ィイD23ィエD2 SiィイD23ィエD2 N ィイD24ィエD2 to γ-stainless steel by this proposed bonding was done. Main results obtained are as follows :(1) Crack propagates usually in ceramic at conventional bonding(Ag-Cu-Ti direct brazing).This crack was prevented perfectly by proposed bonding.(2) Residual stress in ceramic was analyzed by Thermo- elasto-plastic analysis by FEM. It was confirmed that residual stress in ceramic at conventional bonding was equivalent to strength of base ceramic and reduced to 23-50% by proposed bonding. It is assumed that prevention of crack is due to this reduction of residual stress in ceramic.(3) Joint strength of proposed bonding was investigated by 4-point bending test.Excellent strength was obtained.
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深谷保博ほか: "Ag,Cu薄膜ろう付とパルス通電加熱接合を併用したSi_3N_4とSUS304の接合"溶接学会全国大会講演概要. 第65集. 584-585 (1999)
Yasuhiro Fukaya 等人:“结合使用 Ag、Cu 薄膜钎焊和脉冲电流加热连接来连接 Si_3N_4 和 SUS304”,全国焊接学会会议上的演讲摘要,第 65 卷,第 584-585 卷(1999 年)。
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深谷保博ほか: "Ag薄膜ろう付+放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合"溶接学会全国大会講演概要. 第63集. 360-361 (1998)
Yasuhiro Fukaya等人:“通过Ag薄膜钎焊+放电等离子体加热接合方法进行Al_2O_3/SUS304的残余应力松弛接合”日本焊接学会全国会议上的演讲摘要63. 360-361卷。
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深谷保博ほか: "セラミックス/金属接合体における残留応力とセラミックスの割れ"日本機械学会第7回機械材料・材料加工技術講演会講演論文集. No99-23. 283-284 (1999)
Yasuhiro Fukaya 等人:“陶瓷/金属接头中的残余应力和陶瓷裂纹”日本机械工程师学会第七届机械材料和材料加工技术会议论文集第 283-284 号(1999 年)。
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Y. Fukaya, etal.: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding after Ag Brazing."Preprints of the national meeting of J. W. S.. 63. 360-361 (1998)
Y. Fukaya 等人:“Ag 钎焊后通过放电等离子加热粘合来消除 AliD22D2 /SUS304 粘合接头的应力。”J. W. S. 全国会议预印本 63. 360 -361 (1998)
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Y. Fukaya, etal: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding with Cu Powder after Cu Brazing"Preprints of the national meeting of J. W. S.. 63. 362-363 (1998)
Y. Fukaya 等人:“Cu 钎焊后通过放电等离子加热与 Cu 粉接合的 AliD22D2 O D23D2 /SUS304 接合接头的应力消除”J. W. S. 全国会议预印本 63. 362-363 (1998)
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共 10 条
Soft Soldering of Carbon Materials after Metalizing
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批准号:17560655
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项目类别:Grant-in-Aid for Scientific Research (C)
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资助金额:$2.18万
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财政年份:2005
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负责人:FUKAYA Yasuhiro
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依托单位:
Bonding of Carbon Material by Sinter bonding with adhesive resin using direct current heating and pressing
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批准号:13650787
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项目类别:Grant-in-Aid for Scientific Research (C)
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资助金额:$1.54万
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财政年份:2001
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负责人:FUKAYA Yasuhiro
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依托单位: