Development for New Method of Preparation of Fine particles utilizing Splashing phenomena in Molten Metal with Ammonia gas.

利用氨气在熔融金属中的飞溅现象制备细颗粒的新方法的开发。

• 批准号: 09650807
• 负责人: YOKOYAMA Seiji
• 金额: $ 1.92万
• 依托单位: Toyohashi University of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1997
• 资助国家: 日本
• 起止时间: 1997 至 1998
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-09650807/
• 关键词: splah; ammonia; fine metallic particle; evaporation rate; tin base alloy; copper base alloy; 銅; すず

In previous studies on evaporation of molten metals in reactive gas flows, it was found that molten copper was splashed when it was held in ammonia gas. The splashing phenomena gave me a new idea for producing fine metallic particles. Then I named the new method "ammonia splashing method." In this study, as a fundamental study on the preparation of the fine particles with the ammonia splashing method, the splashing behavior of molten metals that were held in ammonia gas flows was investigated in order to clarify the effects of the temperature of the molten alloy, the content of the alloying element, ammonia gas flow rate, and the molar fraction of ammonia in gas mixture on both the rate of splash, i.e. the production rate, and characteristics of the obtained particles.Molten pure silver, lead and bismuth were not splashed, but molten copper and tin were splashed. The splash rates of copper-tin, -silver, -lead alloys and tin-silver, - bismuth, -lead, -copper alloys decreased with increasing the content of alloying element. The rate of splash increased with increasing ammonia gas flow rate and with rising the temperature of molten alloy. The rate of splash in ammonia + hydrogen gas mixture was larger than that in ammonia + argon and + nitrogen. The rate of splash increased with molar fraction of ammonia in the gas mixtures.The gotten particles by the splash were spheric and metallic, The size of the particles ranged to 0.1 - 150 mu m. The particles with relatively large size had cavities. The mean particle diameter of the particles increased with increasing the content of alloying element and with rising the temperature of the molten alloy. Also, it increased with increasing the distance between the melt surface the and the tip of the lance for introduction of ammonia.

在以往关于反应气体中熔融金属蒸发的研究中，发现熔融的铜在氨气中保持时会发生飞溅。飞溅现象给了我一个生产精细金属颗粒的新想法。然后，我把这种新方法命名为“氨溅溅法”。本研究作为氨气溅射法制备超细颗粒的基础性研究，研究了金属熔体在氨气中的溅射行为，以明确合金熔体温度、合金元素含量、氨气流量和混合气体中氨的摩尔分数对溅射率(即产率)和所得颗粒的特征的影响。随着合金元素含量的增加，铜-锡、银、铅合金和锡-银、铋、铅、铜合金的飞溅率降低。溅射率随氨气流量的增大和合金熔体温度的升高而增大。在氨气+氢气混合气体中的飞溅速率大于在氨气+氩气+氮气中的飞溅速率。溅射率随混合气体中氨气摩尔分数的增加而增加，溅射得到的颗粒为球形和金属型，颗粒尺寸在0.1~150微米之间，尺寸较大的颗粒有空洞。颗粒的平均直径随合金元素含量的增加和合金熔体温度的升高而增大。同时，随着熔体表面与喷枪喷头之间距离的增加，喷氨量也随之增大。

项目成果

Seiji Yokoyama: "Production of Fine Copper-Tin Particles with Ammonia Splashing Method" The Third Pacific Rim Conference on Advanced Materials and Processing(PRICM 3)edited by M.A.Imam et al.,TMS. 1. 1111-1116 (1998)

Seiji Yokoyama：“用氨喷溅法生产精细铜锡颗粒”第三届环太平洋先进材料与加工会议（PRICM 3），M.A.Imam 等人编辑，TMS。

Seiji Yokoyama: "Production of Fine Copper Particles with Ammonia Splashing Method" Intern.Symp.on Design, Processing and Properties of Advanced Engineering Materials, Toyohashi, Japan, JSPS AEM 156 Committee,. 697-701 (1997)

Seiji Yokoyama：“用氨喷溅法生产细铜颗粒”实习生。先进工程材料的设计、加工和性能，日本丰桥，JSPS AEM 156 委员会。

Seiji Yokoyama: "Production of Fine Copper Particles with Ammonia Splashing Method." International Symposium on Design, Processing, and Properties of Advanced Engineering Materials, Toyohashi, Japan, JSPS 156 Commitee. 697-701 (1997)

Seiji Yokoyama：“用氨溅射法生产细铜颗粒。”

Seiji Yokoyama: "Production of Fine Copper-Tin Particles with Ammonia Splashing Method" The Third Pacific Rim Conference on Advanced Materials and Processing (PRICM 3) edited by M.A.Imam et al., TMS. 1. 1111-1116 (1998)

Seiji Yokoyama：“用氨喷溅法生产细铜锡颗粒”第三届环太平洋先进材料与加工会议 (PRICM 3)，M.A.Imam 等人编辑，TMS。

Seiji Yokoyama: "Production of Fine Copper-Tin Particles with Ammonia Splashing Method." The Third Pacific Rim Conference on Advanced Materials and Processing (PRICM-3) edited by M.A.Imam et al., TMS. 1111-1116 (1998)

Seiji Yokoyama：“用氨溅射法生产细铜锡颗粒。”