Migration Phenomena of Silver and Copper on Surface of Non-organic and Organic Insulating Materials and the Effect of its Suppression
Migration Phenomena of Silver and Copper on Surface of Non-organic and Organic Insulating Materials and the Effect of its Suppression
批准号:
60550191
负责人:
YOSHIMURA Noboru
金额:
$0.45万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1985
资助国家:
日本
项目状态:
已结题
起止时间:
1985 至 1986
中文摘要
银和铜迁移,在直流电压下的影响下,被观察到通过非电陶瓷表面(CD)使用高电压的冷凝器和三种有机绝缘材料(如苯甲酸纸层(PL)、环氧树脂含有玻璃纤维(GE)和聚苯乙烯含有玻璃纤维(GMP)。测试条件为60 ° C,80% R.H.。柴油陶瓷应用于250V直流电,有机绝缘材料应用于100V直流电,首先,水含量被测量为所有材料。在100小时内找到的水含量为1.4%。在另一方,非电陶瓷被发现在以下0.05%。通用电气和GMP约占0.2%,没有非电致性陶瓷的迁移现象。它被发现了,如何,因为PL的银迁移很容易与GE和GMP相比较。PL的表面抵抗力明显减少了相对于波动的应用时间。这是因为在PL容易添加的水中的文件,在另一边,在200小时内没有发现铜电极的迁移,在300小时内发现了一个用环氧树脂涂层的小迁移。这似乎是环氧树脂抑制了水的吸收。
英文摘要
Silver and copper migration, under the influence of a dc voltage, have been observed through the surface of a dielectric ceramic(CD) used as high voltage condenser and three kinds of organic insulating materials such as phenolic paper laminate(PL), epoxy resin contained glass fiber(GE) and polyester contained glass fiber(GMP). The test condition was 60゜C and 80% R.H. The dielectric ceramic was applied 250 V dc and the organic Insulating materials were applied 100 V dc.At first, the water content was measured for all materials. The water content of PL was found to be 1.4 % during 100 hours. On the other hand, the dielectric ceramic was found to be below 0.05 %. GE and GMP were about 0.2 %.There was no migration phenomenon for dielectric ceramics. It was found, however, that the silver migration for PL was easily occurred as compared with that for GE and GMP. The surface resistivity for PL was abruptly reduced against the application time of voltage. This is because the paper in PL easily adsorps water.On the other hand, no migration was found for copper electrode even PL during 200 hours.There was found a little migration for PL coated with epoxy resin during 300 hours. It seems that epoxy resin supresses the absorption of water.
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吉村昇: 靜電気学会誌. 11. (1987)
Noboru Yoshimura:电气工程师学会杂志11。(1987)
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作者:
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通讯作者:
吉村昇: 電気関係学会東北支部連合大会講演論文集. 1F-7. 182 (1986)
Noboru Yoshimura:电气协会东北分会会议记录 1F-7(1986)。
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通讯作者:
N. Yoshimura, N. Konno, M. Nishida, S. Takahashi and F. Noto: "Migration of Silver and Copper on Surface of Organic Insulating Materials" Tohoku-Section Joint Convention Record of Institutes of Electrical and Information Engineers. 1F-7. 182 (1986)
N. Yoshimura、N. Konno、M. Nishida、S. Takahashi 和 F. Noto:“有机绝缘材料表面银和铜的迁移”电气和信息工程师学会东北分会联合会议记录。
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通讯作者:
N. Yoshimura, M. Nishida, S. Fujita and F. Noto: "Migration Phenomena of Silver and Copper on Surface of Insulating Materials" Annual Report: Conference on Electrostatics of Japan. 24p-A7. 127-128 (1986)
N. Yoshimura、M. Nishida、S. Fujita 和 F. Noto:“绝缘材料表面银和铜的迁移现象”年度报告:日本静电会议。
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通讯作者:
N. Yoshimura, M. Nishida, S. Fujita and F. Noto: "Migration Phenomena of Silver and Copper Electrodes on Surface of Organic Insulating Materials" Proceedings of the Institute of Electrostatics Japan. 11. (1987)
N. Yoshimura、M. Nishida、S. Fujita 和 F. Noto:“有机绝缘材料表面银和铜电极的迁移现象”日本静电研究所论文集。
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