Frictional Properties of Micromechatoronics Elements

硅片因其优异的机械特性，常被用作微型机械。然而，硅在高温下表现出很大的粘附力，因此预测随着温度的升高，微机械的运动将变得更差。因此，有必要了解温度对硅片静摩擦的影响，以及在高温下减小粘附力的必要性。在本研究中，利用毫米级动子在20ﾟC到200ﾟC的温度范围内测量了硅片与硅片、SiO_2和Al薄膜的静态摩擦系数，并测量了随着温度的升高，硅片与硅片、SiO_2和Al薄膜的粘附力。13EA03：发现随着温度的升高，硅片与硅片的静态摩擦系数增加。这是由于硅片之间粘附力的增加造成的。然而，如果我们在厚度超过100 nm的硅片表面沉积SiO_2和Al薄膜，摩擦力不随温度变化，并且呈现几乎恒定的小值。

Silicon wafer is often used for a micromachine because of its excellent mechanical characteristics. However, silicon shows a large adhesive force at a high temperature, so it is predicted that a movement of micromachine would get worse with increase of a temperature. Therefore, it is necessary to understand the effect of the temperature on static friction for silicon wafer and it is also necessary to reduce an adhesive force at a high temperature.In the present study, static friction coefficients of silicon wafer against silicon wafer, SiO_2 and Al thin films were measured by using a milimeter sized mover at the temperature from 20ﾟC to 200ﾟC.We also measured an adhesive forces of silicon wafer against silicon wafer, SiO_2 and Al thin films with increasing a temperature.13EA03 : It was found that the static friction coefficient of silicon wafer against silicon wafer was increased with the increase of the temperature. This caused by the increase of the adhesive force between silicon wafers. However, if we depositted an SiO_2 and Al thin films on the surface of a silicon wafer with the thickness over 100nm, the frictional force did not vary with the temperature and those showed an almost constant small value.