Frictional Properties of Micromechatoronics Elements

硅片由于具有优良的机械特性，常用于微型机械制造。然而，硅在高温下表现出较大的附着力，因此可以预测，随着温度的升高，微机械的运动将会变差。因此，有必要了解温度对硅片静摩擦的影响，也有必要降低高温下的附着力。在20 ~ 200ºC的温度范围内，采用毫米尺寸的移动仪测量了硅片与硅片、SiO_2和Al薄膜之间的静摩擦系数。随着温度的升高，我们还测量了硅片对硅片、SiO_2和Al薄膜的附着力。结果表明，硅片与硅片的静摩擦系数随着温度的升高而增大。这是由于硅片之间的附着力增加所致。而在厚度大于100nm的硅片表面沉积SiO_2和Al薄膜时，摩擦力不随温度的变化而变化，几乎呈恒定的小值。

Silicon wafer is often used for a micromachine because of its excellent mechanical characteristics. However, silicon shows a large adhesive force at a high temperature, so it is predicted that a movement of micromachine would get worse with increase of a temperature. Therefore, it is necessary to understand the effect of the temperature on static friction for silicon wafer and it is also necessary to reduce an adhesive force at a high temperature.In the present study, static friction coefficients of silicon wafer against silicon wafer, SiO_2 and Al thin films were measured by using a milimeter sized mover at the temperature from 20ﾟC to 200ﾟC.We also measured an adhesive forces of silicon wafer against silicon wafer, SiO_2 and Al thin films with increasing a temperature.13EA03 : It was found that the static friction coefficient of silicon wafer against silicon wafer was increased with the increase of the temperature. This caused by the increase of the adhesive force between silicon wafers. However, if we depositted an SiO_2 and Al thin films on the surface of a silicon wafer with the thickness over 100nm, the frictional force did not vary with the temperature and those showed an almost constant small value.