Development of the Non-Contact Characterization Techniques of Minority Carrier Lifetime and Surface Recombination Conditions of Semiconductor Wafers
Development of the Non-Contact Characterization Techniques of Minority Carrier Lifetime and Surface Recombination Conditions of Semiconductor Wafers
批准号:
01550246
负责人:
USAMI Akira
金额:
$0.26万
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1989
资助国家:
日本
项目状态:
已结题
起止时间:
1989 至 1990
中文摘要
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英文摘要
From the theoretical analysis of the photoconductivity decay method (WLT) with small alpha delta-function carrier injection pulse and photoconductivity modulation method (SRMI and R-SRMI) with large alpha carrier injection pulse, it is found that SRMI and R-SRMI are more sensitive than the WLT method. Furthermore, R-SRMI method is insensitive to tau_b, because the R-SRMT signal is defined as the value subtracted SRMI (large alpha injection) from the BRMI (small alpha injection). The R-SRMI has inverse relation to SRMT and is related to S_<eff> closely. The R-SRMI is insensitive to tau_b and is very suitable for i) different condition Si wafers, especially surface active region, ii) a wafer which has distribution of tau_b and/or resistivity in LST processes. SRMI and R-SRMI measurements can reduce the calculation time compared to the photoconductivity decay curves analysis (WLT ; tau_b and S_<eff>).The laser-microwave characterization systems (WLT, SRMI and R-SRMI measurement) are successively applied to several wafer processes, detection of surface contamination of the starting wafer, oxidation and its dry etching, ion implantation and annealing processes, junction formation by impurity diffusion, alloying processes etc. The change of the SRMI and/or R-SRMI at contaminated wafer surface are two to three times larger than those of WLT values. The SRMI and R-SRMI mapping measurement systems with laser-microwave are convenient, practical and useful ways for characterizing the Si wafer in various device fabrication processes.
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宇佐美 晶: "2波長光源を用いた光伝導度変調法によるSiウェ-ハ表面の汚染パタ-ンの非接触評価" 電子情報通信学会技報シリコン材料デバイス. SDMー90ー41. 31-36 (1990)
Akira Usami:“使用双波长光源通过光电导调制方法对硅晶片表面的污染图案进行非接触式评估”IEICE 技术报告 SDM-90-41 (1990)。
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Akira Usami: "Highーsensitivity surface Characterization with injected carriers by laser beam using focused reflectance microwave probe method" Journal of Crystal Growth. 103. 179-187 (1990)
Akira Usami:“使用聚焦反射微波探针方法通过激光束注入载流子进行高灵敏度表面表征”《晶体生长杂志》103. 179-187 (1990)。
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宇佐美 晶、徳田 豊: "半導体デバイス工程評価技術" 株式会社 リアライズ社, 628 (1990)
Akira Usami、Yutaka Tokuda:《半导体器件工艺评估技术》Realize Co., Ltd.,628(1990)
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Akira Usami: "Contactless measurements of the surface recombination velocity of PーN and highーlow (PーP^+、NーN^+)Junctions fabricated by rapid thermal processing" Mat.Res.Soc.Symp.Proc.146. 359-364 (1989)
Akira Usami:“通过快速热处理制造的 PN 和高低 (P-P^+, N-N^+) 结的表面复合速度的非接触式测量”Mat.Res.Soc.Symp.Proc.146 .359-364 (1989 )
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Akira Usami: "Material and Process Learning by Non-Contact Characterization of Minority Carrier Lifetime and Surface Recombination Condition (invited paper)" IEEE International Conference on Microelectronic Test Structures, March 18-20 1991. 1-10 (1991)
Akira Usami:“Material and Process Learning by Non-Contact Characterization of Minority Carrier Lifetime and Surface Recombination Condition (invited paper)” IEEE 国际微电子测试结构会议,1991 年 3 月 18-20 日。1-10 (1991)
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共 19 条
Measurement method of in-depth profiles of recombination lifetime in epitaxial Si layer with test element pattern
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批准号:03650259
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项目类别:Grant-in-Aid for General Scientific Research (C)
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资助金额:$0.32万
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财政年份:1991
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负责人:USAMI Akira
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依托单位:
Study of the High Efficiency Silicon Solar Cells by Light-Induced Diffusim Technique.
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批准号:60550230
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项目类别:Grant-in-Aid for General Scientific Research (C)
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资助金额:$0.26万
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财政年份:1985
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负责人:USAMI Akira
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依托单位: