Development of New type slicing machine that has slicing technology pplying lecthephoretic Deposition

点击翻译按钮获取中文摘要

It Is very Important to decrease the amount of chipping in the dicing process of brittle materials for the reduction of material loss and the improvement of surface Integrity In the production of optical and electrical components. The use of ultrafine abrasives reduces the grain depth of cut. which results In the minimization of subsurface damage. Thus, a new dicing technology has been developed by applying electrophoretic deposition of ultrafine abrasives. During the process. the abrasives cohered around the thin conductive blade used as the anode in an electric field and polished the side surfaces of grooves. Consequently, chipping-free dicing was accomplished and an optically smooth surface was obtained on the side surfaces of the groove.