Development of New type slicing machine that has slicing technology pplying lecthephoretic Deposition

采用电泳沉积切片技术的新型切片机的研制

• 批准号: 02555024
• 负责人: TANI Yasuhiro
• 金额: $ 5.57万
• 依托单位: Univ. of Tokyo
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Developmental Scientific Research (B)
• 财政年份: 1990
• 资助国家: 日本
• 起止时间: 1990 至 1991
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-02555024/
• 关键词: Ultrafine Abrasives; Abrasive Cutoff; Electrophoretic Deposition; Chipping; Brittle Materials; Grinding; Colloidal Silica; ダイシング; スライシング; 電着現象; コロイダルシリカ; 外周刃

It Is very Important to decrease the amount of chipping in the dicing process of brittle materials for the reduction of material loss and the improvement of surface Integrity In the production of optical and electrical components. The use of ultrafine abrasives reduces the grain depth of cut. which results In the minimization of subsurface damage. Thus, a new dicing technology has been developed by applying electrophoretic deposition of ultrafine abrasives. During the process. the abrasives cohered around the thin conductive blade used as the anode in an electric field and polished the side surfaces of grooves. Consequently, chipping-free dicing was accomplished and an optically smooth surface was obtained on the side surfaces of the groove.

在光学和电子元件的生产中，减少脆性材料切割过程中的碎屑量对于减少材料损失和提高表面完整性是非常重要的。超细磨料的使用减少了切削的颗粒深度。从而使表面下的损伤最小化。因此，一种新的切割技术已被开发，通过应用电泳沉积超细磨料。在这个过程中。研磨剂在电场中围绕用作阳极的薄导电刀片粘结并抛光凹槽的侧表面。因此，实现了无碎片的切割，并且在凹槽的侧表面上获得了光学平滑的表面。

项目成果

Junichi IKENO: "Ultra precision grinding Applying electrophoretic deposition of ultrafine Abrasives" Machinetool & Machine-technology. 32. 116-121 (1991)

Junichi IKENO：“超细磨料电泳沉积的超精密磨削”机床

J.IKENO,Y.TANI,A.FUKUTANI: "Development of Chipping-Free Dicing Technology Applying Electlophoretic Deposition of Ultrafine Abrasives" Annals of ClRP. 40. 351-354 (1991)

J.IKENO、Y.TANI、A.FUKUTANI：“应用超细磨料电泳沉积的无碎裂切割技术的开发”ClRP 年鉴。

池野 順一: "超微細砥粒の電気泳動現象を利用した超精密研削" 応用機械工学. 32. 116-121 (1991)

Junichi Ikeno：“利用超细磨粒的电泳现象进行超精密磨削”《应用机械工程》32. 116-121 (1991)。

J. IKENO, Y. TANI, A, FUKUTANI: "Development of Chipping-Free Dicing Technology Applying Electrophoretic Deposition of Ultrafine Abrasives" Annalys of CIRP. 40. 351-354 (1991)

J. IKENO、Y. TANI、A、FUKUTANI：“应用超细磨料电泳沉积的无碎裂切割技术的开发”CIRP 分析。

池野 順一,谷 泰弘,福谷 亮人: "超微細砥粒の電気泳動現象を利用した研削切断法の開発" 生産研究. 43. 5-8 (1991)

Junichi Ikeno、Yasuhiro Tani、Ryoto Fukutani：“利用超细磨粒的电泳现象开发磨削和切削方法”生产研究 43. 5-8 (1991)。