Development of fixed abrasive tools utilizing sol-gel method

利用溶胶-凝胶法开发固结磨具

• 批准号: 12450055
• 负责人: TANI Yasuhiro
• 金额: $ 7.55万
• 依托单位: The University of Tokyo
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2000
• 资助国家: 日本
• 起止时间: 2000 至 2001
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-12450055/
• 关键词: Polishing; High-Performance abrasive; Sol-Gel method; Agglomerative abrasive grain; Fixed-Abrasive tool; Loose abrasive tool; 砥粒加工; 高機能砥粒; 凝集砥粒; 固定砥粒加工; 遊離砥粒加工; 機械工作; 超精密加工; 固定砥粒加工工具

Conventional vitrified grinding stones are manufactured utilizing by dry-state molding method so that homogeneity in dispersion of abrasives deteriorates when fine abrasives are used. Then sol-gel method was applied to manufacture grinding stones, which enabled production of homogeneous porous structure even if fine abrasives were used. As the result it was made clear that the sol-gel method was suitable for manufacturing of bridge-structured grinding stones with fine abrasives and the stone structure could be changed with composition of the starting solution. The hardness of the stones was changed by baking temperature with no change of the structure. Mirror finish of 25nmRy was accomplished using a GC#10000 stone in infeed grinding of a silicon wafer.

传统的玻璃化磨石是用干态成型方法制造的，因此当使用细粒磨料时，磨料分散的均匀性变差。然后采用溶胶-凝胶法制备磨石，即使使用细小的磨料也能得到均匀的多孔结构。结果表明，溶胶-凝胶法适合于制备具有细粒磨料的桥式结构磨石，并且可以根据起始溶液的组成改变磨石的结构。烘烤温度改变了结石的硬度，但不改变结石的结构。用GC#10000磨石对硅片进行进给磨削，完成了25nmRy的镜面抛光。

项目成果

Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer

利用团聚超细二氧化硅磨料开发硅片边缘精加工研磨膜

• 发表时间: 2001
• 期刊: Proc. ICPE2001
• 作者: T.Enomoto;Y.Tani;K.Orii
• 通讯作者: K.Orii

T.Enomoto, Y.Tani, K.Orii: "Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer"Proc. ICPE2001. 391-395 (2001)

T.Enomoto、Y.Tani、K.Orii：“利用聚结超细二氧化硅磨料开发研磨薄膜，用于硅晶片边缘精加工”Proc。