Electroless Plating of Plastics Activated with Mixed Hydroxide Colloids

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The applicability of a method of acivation using mixed hydroxide colloids was studied for the electroless plating of Cu, Ni, Co and Ni-Co alloy onto various plastics. Furthermore, zeta-potentials were measured for various oxides to understand the mechanism of the activation process.The main results were as followed :(1) The isoelectric points Of SiO_2, ZrO_2, CuO, NiO, Cu(OH)_2 and Ni(OH)_2 were found to be 3.35, 4.6, 6.0, 7.7, 7.8 and 8.7 respectively. Also the plastics used in the present work were found to be charged negatively.(2) The adsorbtion of hydroxide colloid onto ABS plastic is infl enced by the temperature of the colloidal solution, suggesting the activation process is chemical adsorbtion.(3) The plastics, including ABS, PP, PE, PS, PC, PVC were satisfactorily activated with colloid aggregates of Ni(OH)_2-Cu(OH)_2 for electroless plating of copper. This activation method was also found to be applicable to the electroless plating of Ni, Co and Ni-Co alloy on ABS plastics.(4) The adhesion strength and brightness of Cu or Ni films formed on the ABS plastic were amply competitive with those activated by a conventiona SnCl_2-PdCl_2 method.(5) The copper films formed on ABS plastic, activated with mixed colloids prepared with Na_2CO_3 solution were good in brightness and adhesion force compared with those activated with mixed colloids the prepared with NAOH solution.(6) The catalytic effect of copper electrode for the anodic oxidation of HCHO solution was found to be large compared with that of Ni electrode.(7) The mechanism of the process of activation of plastics can be explaned by surface electrochemistry.