Development of Lead Free Solder for Microjoining

用于微连接的无铅焊料的开发

• 批准号: 07555628
• 负责人: OTSUKA Masahisa
• 金额: $ 0.64万
• 依托单位: Shibaura Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1996
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07555628/
• 关键词: Solder; Lead free; Sn-Pb; Eutectic Alloy; Wettability; Mechanical Propexties; Fatigue; Thermal Fatigue; 無鉛はんだ; Sn-Ag; 疲労試験; 寿命; 冷却速度; Sn-Ag共晶合金; Sn-Pb共晶合金; クラック

The effect of thermal cycles on the degradation process of lead free solder, Sn-3.5%Ag eutectic, which is regarded as one of the most possible candidates, has been investigated in comparison with that observed in conventional lead bearing alloy (Sn-37%Pb eutectic). Thermal cycles were applied by the use of thermoelectric modules, with which both heating and cooling programs are precisely controlled over the temperature range from subzero to above 373K.Thereafter the thermal fatigue resistance was evaluated through the peeling strength. It is found that Sn-Ag eutectic is superior in the thermal fatigue resistance to conventional Sn-Pb eutectic alloy, though the former is weaker than the latter if not subjected to the thermal faigue. The degradation of Sn-Pb eutectic during thermal cycling can be ascribed to the microstructural coarsening, which in turn is enhanced by the stress concentration occurring at and around the solder joint. It is also found that the peeling strength of solder joint depends on the deformation speed, meaning that the deformation speed must be identified in order to evaluate the strength of joint.

本文研究了热循环对无铅钎料Sn-3.5%Ag共晶的退化过程的影响，并与传统的含铅合金Sn-37%Pb共晶的退化过程进行了比较。利用热电模块对试样进行热循环，在温度范围从零度以下到373 K以上的温度范围内精确控制加热和冷却程序，然后通过剥离强度评价试样的热疲劳抗力。结果表明，Sn-Ag共晶合金的抗热疲劳性能比常规Sn-Pb共晶合金好上级，但在不发生热疲劳的情况下，前者的抗热疲劳性能比后者差。Sn-Pb共晶在热循环过程中的退化可以归因于微观结构的粗化，这反过来又是由应力集中发生在焊点和周围增强。焊点的剥离强度取决于变形速度，这意味着必须识别变形速度才能评估焊点的强度。

项目成果

大塚・川口・平松・小嶋: "熱疲労によるはんだ接合部の損傷過程" Proc.2nd Symp.Microjoining and Assembly Technology in Electronics. 1. 183-188 (1996)

Otsuka、Kawaguchi、Hiramatsu、Kojima：“热疲劳引起的焊点损坏过程”Proc.2nd Symp.Microjoining and Assembly Technology in Electronics 1. 183-188 (1996)。

川口・小嶋・前園・長屋・大塚: "ハンダの濡れ速度の測定" 金属. 66. 853-860 (1996)

Kawaguchi、Kojima、Maezono、Nagaya、Otsuka：“焊料润湿速度的测量”金属。 66. 853-860 (1996)

Kawaguchi, Kojima, Maezono, Nagaya, Otsuka: "Measurement of Wetting Speed of Solder" Kinzoku. Vol.66. 853-860 (1996)

Kawaguchi、Kojima、Maezono、Nagaya、Otsuka：“焊料润湿速度的测量”Kinzoku。

Otsuka, Oguchi: "Effect of Interface Reaction Products on the Fatigue Life of Solder/Cu Joint" Proc.Interconnection Interface Science and Technology (JIMIS-8). Vol.1. 467-470 (1996)

Otsuka、Oguchi：“界面反应产物对焊料/铜接头疲劳寿命的影响”Proc.Interconnection Interface Science and Technology (JIMIS-8)。

Kariya, Kawamata, Otsuka: "Effect of Microstructure on Isothermal Fatigue Properties of Sn-3.5%Ag Alloy" Proc.3rd Symp.Micro-joining and Assembly Technology in Electronics. Vol.3. 89-94 (1997)

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