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Ultra precision dry cutting by diamond tool with heat sink layr

带散热层的金刚石刀具超精密干切削

基本信息

批准号：
07650137
负责人：
YOKOYAMA Kazuhiro
金额：
$ 1.47万
依托单位：
Niigata University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650137/
关键词：
Diamond tool Dry ultra precision cutting Cutting force Temperature of tool Tool wear Surface roughness Chip ダイヤモドバイトヒートシンク乾式切削超精密切削工具磨耗温度面粗さ

项目摘要

Since the content of minute diamond particles involved in the electroless-plated Ni・P layr is about 4wt% ( : 6.6Vol%), the thermal conductivity of the layr is not large enough as a heat-sink layr for temperature control of cutting edge of diamond tool. It is observed a constant cutting force in wet cutting. But a changeable force in dry operation is observed and this becomes from the change in true depth of cut by thermal elongation due to cutting heat. Temperature increase of diamond tool in dry cutting is nearly three times of that in wet cutting. Recession amount of cutting edge of the tool is small, but it is obtained from a change in the contour of cutting edge made by plunge type cutting. Surface roughness by wet cutting is nearly the same as the theoretical value, but that by dry cutting is several times of the theoretical one. From the SEM photograph of chips the uniform layrs are observed all over the free surface of chip formed by shearing deformation. Several obvious lines along the chip flowing direction are observed over the surface rubbed against rake face. Along these lines, sometimes, series of small holes are found or the chip is separated and hence only narrow chips are observed. Mirror surface are not made on aluminum workpiece by dry cutting.

由于化学镀Ni·P层中金刚石微粒的含量约为4wt%（6.6Vol%），其导热系数不足以作为金刚石工具刃口温度控制的散热层。在湿切削中，切削力是恒定的.但是在干操作中观察到变化的力，这是由于切削热引起的热伸长引起的真实切削深度的变化。干切削时金刚石刀具的温升是湿切削时的近3倍。刀具切削刃的后退量很小，但它是由切入式切削引起的切削刃轮廓的变化而获得的。湿切削的表面粗糙度与理论值基本一致，而干切削的表面粗糙度是理论值的数倍。从切屑的扫描电镜照片中可以看到，切屑自由表面上布满了均匀的分层。在与前刀面摩擦的表面上观察到几条沿着切屑流动方向的明显线条。沿着这些线，有时会发现一系列小孔或芯片分离，因此只能观察到窄芯片。铝工件干切削加工不产生镜面.