Additive Technology for 3D-Shapeable Millimeter-Wave Passive Components

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Performance of millimeter-wave passive components, which are needed, for instance, for wireless communication and sensing, is widely influenced by the materials and manufacturing technologies these components are based of. There is a strong need for innovative cost-efficient, high-performant techniques to realize such components. The project aims to explore ground laying aspects for the cost-efficient manufacturing of 3D-shapeable millimeter-wave passive components using additive manufacturing, that is, printing technology. The project will address single-layer and multi-layer manufacturing of 3D-shapeable interconnects and circuits by several different printing technologies. The project will explore the combination of printed dielectric and printed metal structures, together with their requirements and performances for millimeter-wave passive circuit components. It will determine possibilities and limitations of inkjet, dispensing and 3D filament printing. Materials and test structures will be thoroughly investigated with respect to technological usability and millimeter-wave performance. Example structures that will be designed and characterized, for operation between 30 GHz and 140 GHz, will include a variety of transmission lines, antennas and planar-to-waveguide transitions.