Multicast chip-to-chip interconnect based on millimeter-wave dielectric waveguide

基于毫米波介质波导的多播芯片间互连

• 批准号: 408428878
• 负责人: Professor Dr. Jan Hesselbarth
• 金额: --
• 依托单位: Institut für Hochfrequenztechnik (IHF)
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2018
• 资助国家: 德国
• 起止时间: 2017-12-31 至 2019-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/408428878?language=en
• 关键词: Multicast; chip; interconnect; based; millimeter

High data-rate inter-chip / intra-chip communication is of growing importance for modern computer systems. Feasible technologies allowing for broadcast / multi-cast transmission with small latency, low attenuation, and reasonable data throughput do not exist. The project aims to develop and to explore the possible performance of a new board-level chip-to-multi-chip interconnect scheme. The technology to be explored in the proposed project alleviates several drawbacks of wired, wireless and optical interconnect techniques. The proposed interconnect uses low-loss dielectric waveguide, low-leakage Y-junctions in dielectric waveguide, and low-loss and compact transitions from on-chip circuit to dielectric waveguide, which in combination results in a feasible high-performant millimeter-wave multi-chip interconnect. The proposed technique excels with low-loss transmission, small latency and small chip-area consumption. Based on extensive preliminary work done by the applicant, the project is aiming to optimize the overall structures, to implement additional loss-reducing features, and to demonstrate benchmarking performance at a frequency of 180 GHz.

高数据速率的片间/片内通信在现代计算机系统中越来越重要。允许广播/多播传输具有小延迟、低衰减和合理数据吞吐量的可行技术尚不存在。该项目旨在开发和探索一种新的板级芯片到多芯片互连方案的可能性能。该项目所探索的技术减轻了有线、无线和光互连技术的几个缺点。该互连采用低损耗介质波导、介质波导中的低漏y型结以及片上电路向介质波导的低损耗紧凑过渡，构成了一种可行的高性能毫米波多芯片互连。该技术具有传输损耗低、延时小、芯片面积消耗小等优点。基于申请人所做的大量初步工作，该项目旨在优化整体结构，实现额外的降低损耗功能，并展示180 GHz频率下的基准性能。