MATERIALS DEVELOPMENT AND MICROSTRUCTURAL CONTROL FOR IMPROVING FATIGUE FRACTURE PROPERTIES IN FILM MATERIALS
MATERIALS DEVELOPMENT AND MICROSTRUCTURAL CONTROL FOR IMPROVING FATIGUE FRACTURE PROPERTIES IN FILM MATERIALS
批准号:
10555032
负责人:
TORII Tashiyuki
金额:
$8.26万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
1998
资助国家:
日本
项目状态:
已结题
起止时间:
1998 至 1999
中文摘要
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英文摘要
(1) Using pure copper films, the two types of specimen that rolling direction was parallel and perpendicular to loading direction were prepared for a film fatigue testing. As a result, in the film loaded in the perpendicular direction to the rolling, slips and cracks were initiated at less number of cycles and lower stress amplitude, while a crack propagated slower because of the large crack closure. Also, there was a difference in crack observation on the specimen surface between the two types of specimen with the large aspect ratio of the grain stretched by rolling.(2) Commercially-pure iron films with the thickness of 100μ m were annealed at 873K, 1073K and 1173K after rolling, and the two types of specimen that rolling direction was parallel and perpendicular to loading direction were prepared for a film fatigue testing. The crystallographic analysis using EBSD system showed that the anisotropy of rolling texture remained after annealing, and there was a difference between the two … More types of specimen in crack observation. When compared at the same stress intensity factor range, ΔK_<est>K, evaluated from the crack opening displacement, fatigue cracks propagated faster in the film loaded to the perpendicular direction to the rolling. This was probably because the slip plane was different in accordance with the relationship between the rolling and crack propagation directions.(3) Commercial grade iron films were bonded to steel base plates by using epoxy resin or by diffusion. When using the epoxy resin, the compressive residual stress induced by a shrinkage deformation of the resin during the heat-curing and cooling process was larger in the 100 μm than the 50 μm thickness film, thus increasing the fatigue life in the 100 μm thickness film-bonded plates. On the other hand, under the same effective stress intensity factor range evaluated from crack opening displacements, ΔK_<est>, the fatigue crack propagation rate, da/dN, was almost the same for all the epoxy bonded specimens, but relatively larger in the resin-bonded than the diffusion-bonded film. This showed the lower fatigue crack propagation resistance of the film itself bonded by the epoxy resin layer. Less
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Tashiyuki TORII: "A Method of Film Fatigue Testing and Effects of Rolling Direction on Fatigue Properties in Copper Film"Proceedings of the Advances in Electronic Packaging-1999, ASME. Vol.1. 867-874 (1999)
Tashiyuki TORII:“薄膜疲劳测试方法以及轧制方向对铜薄膜疲劳性能的影响”电子封装进展论文集 - 1999 年,ASME。
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鳥居 太始之: "銅膜材の疲労破壊特性に及ぼす圧延方向の影響"日本機会学会論文集(A編). 65巻631号. 461-468 (1999)
鸟居太一之:“轧制方向对铜膜材料疲劳断裂性能的影响”日本机械工程学会会刊(A版)第65卷,第631期。461-468(1999年)。
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Tashiyuki TORII: "Effects of Rolling Direction on Fatigue Fracture Properties in Copper film"Transactions of JSME. Vol.65. 461-468 (1999)
鸟居 Tashiyuki TORII:“轧制方向对铜膜疲劳断裂性能的影响”JSME 学报。
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Tashiyuki TORII: "A Method of Film Fatigue Testing and Effects of Rolling Direction"Proceedings of the Advances in Electronic Packaging 1999 (InterPACK'99). Vol. 26-1. 867-874 (1999)
Tashiyuki TORII:“薄膜疲劳测试方法和滚动方向的影响”1999 年电子封装进展论文集 (InterPACK99)。
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作者:
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通讯作者:
鳥居太始之: "銅膜材の疲労破壊特性に及ぼす圧延方向の影響" 日本機械学会論文集(A編). 65巻631号. (1999)
Futoshi Torii:“轧制方向对铜膜材料疲劳断裂性能的影响”日本机械工程学会会刊(A版)第65卷,第631期(1999年)。
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共 12 条
Variation of Fatigue / Electric Properties with Reducing Thickness of Laminated Copper Films and Its Controlling Geometric Structural Factor
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批准号:16360056
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项目类别:Grant-in-Aid for Scientific Research (B)
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资助金额:$8.45万
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财政年份:2004
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负责人:TORII Tashiyuki
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依托单位:
Thickness Effects on Fatigue Fracture Properties of Small Sized Materials
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批准号:05452127
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项目类别:Grant-in-Aid for General Scientific Research (B)
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资助金额:$3.2万
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财政年份:1993
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负责人:TORII Tashiyuki
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依托单位:
海外基金