Variation of Fatigue / Electric Properties with Reducing Thickness of Laminated Copper Films and Its Controlling Geometric Structural Factor
Variation of Fatigue / Electric Properties with Reducing Thickness of Laminated Copper Films and Its Controlling Geometric Structural Factor
批准号:
16360056
负责人:
TORII Tashiyuki
金额:
$8.45万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2004
资助国家:
日本
项目状态:
已结题
起止时间:
2004 至 2006
中文摘要
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英文摘要
(1)An ultrasonic acoustic reflectivity measurement and fatigue damage in a surface thin filmFor the fatigue test, two-model specimens of the epoxy-bonded film and diffusion-bonded film were prepared for the S45C base and the pure copper film. The epoxy-bonded specimen has the resin layer between the S45C base and the pure copper film, in contrast to the diffusion-bonded film. As a result, there is a difference between both model specimens in surface fatigue damage observation and ultrasonic acoustic reflectivity during fatigue.(2)Fatigue crack propagation evaluated by electric resistance and ultrasonics in copper film bonded to base metal with resinAs model specimens of surface film-bonded materials, pure copper films with a thickness of 100μm were bonded to the surface of steel base plate with epoxy resin. The distribution of the initial electric resistance was measured on both copper film and base plate by a direct current potential drop technique. As a result, there was a good agree … More ment between the measured and theoretical values. From the fatigue testing results, it was shown that the measured electric resistance increased with the fatigue crack length on the copper film, which was almost equal to the theoretical value calculated for a central slit in a plate with finite width. In addition, the internal crack length during fatigue was examined by ultrasonic testing for the film-bonded specimen. As a result, there was a difference in the fatigue crack length between the surface copper film and the inner base plate. In this connection, this method was available for measurement of electric resistance during fatigue crack propagation on the copper film bonded with resin, irrespective of the crack length in the inner base plate.(3)Fatigue damage evaluation using electric resistance measurement in copper filmThe fatigue testing of the copper films was conducted to the specimen, for which the electric resistance was possible to be measured for the appropriate number of cycles during fatigue. The electric resistance was measured by four-point probe method and the periphery of the notch root was observed at the appropriate number of cycles. Then, relationship between fatigue damage and change of electric resistance was discussed. As a result, the electric resistance of the copper film reduced when slips were observed at first near the notch root by fatigue testing. For the subsequent fatigue testing, the value of the electric resistance increased and then converged upon the smaller value obtained before fatigue testing. Less
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銅膜材の疲労き裂伝ぱ形態と結晶方位変化の相関
铜膜材料疲劳裂纹扩展形貌与晶体取向变化的相关性
DOI:
--
发表时间:
2006
期刊:
第119回破壊力学部門委員会・第34回マイクロマテリアル部門委員会合同公開部門委員会研究討論会 54巻・3号
影响因子:
--
作者:
[清水憲一, 鳥居太始之, 石田浩規]
通讯作者:
石田浩規
A Method of Acoustic Reflectivity Measurement using Ultrasonic Waves and Its Change due to Stress Cycles in Surface Bonded Copper Film
超声波声反射率测量方法及其随表面粘合铜膜应力循环的变化
DOI:
--
发表时间:
2006
期刊:
Proceedings of the Tottori District Joint Conference organized by the Chugoku-Shikoku Branch and Kyusyu Branch of The Japan Society of Mechanical Engineers No.065・2
影响因子:
--
作者:
[Oka T., Torii T., Matsuba A., Shimizu, K.]
通讯作者:
K.
Effects of Interlayer Resin Bonding on Fatigue Crack Initiation/Propagation in Laminate Materials with a Surface Layer of Copper Film
层间树脂粘合对表面铜膜层压材料疲劳裂纹萌生/扩展的影响
DOI:
--
发表时间:
2005
期刊:
2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packasing of MEMS, NEMS, and Electronic Systems
影响因子:
--
作者:
[Akira Matuba, Tashiyuki Torii, DongHui Ma]
通讯作者:
DongHui Ma
Fatigue Crack Propagation in Surface Film-Bonded Materials Using Pure Copper and Commercial Grade Iron Films
使用纯铜和商业级铁膜的表面薄膜粘合材料中的疲劳裂纹扩展
DOI:
--
发表时间:
2004
期刊:
JSME International Journal Series A Vol.47,No.3
影响因子:
--
作者:
[Tashiyuki Torii, Akira Matuba]
通讯作者:
Akira Matuba
銅膜積層材料における疲労き裂の形態および伝ぱ挙動(樹脂膜着層および膜厚さの影響に注目して)
铜膜层压材料疲劳裂纹的形貌和扩展行为(重点关注树脂膜附着力和膜厚的影响)
DOI:
--
发表时间:
2004
期刊:
日本材料学会第27回疲労シンポジュウム講演論文集
影响因子:
--
作者:
[松葉朗, 烏居太始之, 片山喜理]
通讯作者:
片山喜理
共 10 条
MATERIALS DEVELOPMENT AND MICROSTRUCTURAL CONTROL FOR IMPROVING FATIGUE FRACTURE PROPERTIES IN FILM MATERIALS
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批准号:10555032
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项目类别:Grant-in-Aid for Scientific Research (B)
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资助金额:$8.26万
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财政年份:1998
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负责人:TORII Tashiyuki
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依托单位:
Thickness Effects on Fatigue Fracture Properties of Small Sized Materials
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批准号:05452127
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项目类别:Grant-in-Aid for General Scientific Research (B)
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资助金额:$3.2万
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财政年份:1993
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负责人:TORII Tashiyuki
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依托单位:
海外基金