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Measurement of trap level near the electrode and dielectric thin film boundary by TSC and TL

Measurement of trap level near the electrode and dielectric thin film boundary by TSC and TL
利用 TSC 和 TL 测量电极和电介质薄膜边界附近的陷阱能级
批准号:
10650664
负责人:
SALURAI Osamu
金额:
$2.11万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1998
资助国家:
日本
项目状态:
已结题
起止时间:
1998 至 1999

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中文摘要
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英文摘要
Fatigue and leak current of lead titanate and barium strontium titanate films for randam access memory devices were caused by metal ion defects, oxygen vacancy and trapped charge carriers. Objectives of these studies are clarified the relations these defects in the film and TSC peaks related to phase transitions and dielectric relaxation.Polarized barium strontium titanates released electric charges with phase transition from ferroelectric to ferrielectric phase. At phase transition temperature, another new TSC peak was observed except peaks related to phase transition. It was clarified that new peak was generated by relaxing trapped charges in the film.Furthermore, effect of heat treatment for lead titanate films, having relatively low resistivity and leaky property, was studied. Maximum polarization (Pm) of film was lowered and resistivity was increased from 1.2X10ィイD1-8ィエD1 to 3.0X10ィイD1-8ィエD1Ωcm slightly. P-E curves of film were asymmetry with applied electric field. TSC peaks were observed at 74 and 130℃, trap level is 0.45 and 0.52eV respectively for heated films. Otherwise no peak was observed for heated film. It seemed that TSC peaks highly depended on relaxation of electric charge. Leak current properties of films were improved by heating for decreasing the electric charge.
期刊论文(6)
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会议论文
Daisuke NAGANO: "Electrical Properties and Crystal Structures of Semiconductive Nb-doped BaTiOィイD23ィエD2 Thin Film Prepared by MOCVD"Key Engineering Materials (Electroceramics in Japan I). 157-158. 167-174 (1999)
Daisuke NAGANO:“MOCVD 制备的半导体 Nb 掺杂 BaTiO2 薄膜的电性能和晶体结构”关键工程材料(日本电陶瓷 I)167-174(1999)。
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Tung-Jung Wu: "Reduction of Leakage Current in PbtiO_3 Film Fabricated by MOCVD"Key Engineering Materials (Electroceramics in Japan II). 169-170. 123-126 (1999)
吴东荣:“减少MOCVD制备的PbtiO_3薄膜中的漏电流”关键工程材料(日本电陶瓷II)。
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Tung-Jung Wu: "Reduction of Leakage Current In PbTiOィイD23ィエD2 Film Fabricated by MOCVD"Key Engineering Materials (Electroceramics in Japan II). 169-170. 123-126 (1999)
Tung-Jung Wu:“减少 MOCVD 制造的 PbTiO2D23​​D2 薄膜中的漏电流”关键工程材料(日本电陶瓷 II)169-170(1999)。
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