Development of the Process for Electroplating with Thick Palladium for the Purpose of Suppression of Metallic Allergy

A new electrolyte （plating bath） has been developed for palladium electroplating， NHイD24イイD22イイD2POイD2 （100kg/mイD13イD1， NHイD24イD2Cl （25kg/mイD13イD1）， and pure water （900ml） have been added in the NHイD24イD2OH solution （100ml） constrained PdClイD2 （17g）。Palladium was electroplated copper substrates at current d\of 20- 200 A/m__目前钯沉积的有效性约为95%，在20- 30 A/m D12。在这个条件下，平板电影在集群中非常出色。钯电镀铜制剂中氢的集中是通过使用热提取法进行测量的，并且找到了钯电镀薄膜以容纳较大的氢数量。从这一结果来看，有可能获得厚钯薄膜，估计在平板过程中成为氢的拾取物，并对氢实施中的平板薄膜的机械性能进行测定。然后，在平板条件和氢浓度之间的关系被测试了。在平板电影中，水浓缩并不依赖于电影的厚度。浓度在20 A/m时为120质量-ppm，D12质量-ppm，在20 A/m时为D12质量-ppm，在当前密度大于20 A/m时为D12质量-ppm，按顺序减少平板薄膜中的氢浓度，在氢的扩散协同作用下，在D2质量-D2质量-D2中的钯电泳膜被电化学降解方法测量。The Follow has been understood as a result.（1）D2 in the palladium plating film was smaller than D2 in palladium bulk.（2）D2 H2 became large by heat-treating， and D2 H2 in the plating films heat-treated at high temperatures was identical with D2 H2 in the bulk。（3）主要原因是，D2 H2在平板电影中的尺寸比在大块中的尺寸小，但被明确为在平板电影中的固定线条。

A new electrolyte (plating bath) has been developed for palladium electroplating, NHィイD24ィエD2HィイD22ィエD2POィイD24ィエD2 (100kg/mィイD13ィエD1, NHィイD24ィエD2Cl (25kg/mィイD13ィエD1), and pure water (900ml) have been added in the NHィイD24ィエD2OH solution (100ml) constrained PdClィイD22ィエD2 (17g). Palladium was electroplated copper substrates at current densities of 20-200A/mィイD12ィエD1. The current efficiency for palladium deposition was about 95% at 20-30A/mィイD12ィエD1. The plating film at this condition was excellent in luster. The concentration of hydrogen in the palladium electroplated copper specimens was measured by using the heat extraction method, and the palladium plating films were found to contain a large amount of hydrogen. From this result, the inability to obtain thick palladium films is estimated to be the pickup of hydrogen during a plating process, and the deterioration in mechanical properties of the plating film by the hydrogen embrittlement. Then, a relation between the plating condition and the hydrogen concentration was examined. The hydrogen concentration in the plating film did not depend on film thickness. And the concentration was 120mass-ppm at 20A/mィイD12ィエD1 and 20-30mass-ppm at current densities larger than 20A/mィイD12ィエD1.In order to reduce the hydrogen concentration in the plating film, the diffusion coefficient of hydrogen, DィイD2HィエD2 in palladium electroplating films were measured by the electrochemical desorption method. The following has been understood as a result. (1) DィイD2HィエD2 in the palladium plating film was smaller than DィイD2HィエD2 in palladium bulk. (2) DィイD2HィエD2 became large by heat-treating, and DィイD2HィエD2 in the plating films heat-treated at high temperatures was identical with DィイD2HィエD2 in the bulk. (3) The main cause, that DィイD2HィエD2 in the plating films was smaller than that in the bulk, was clarified to be a residual strain in the plating film.