Constitutive relations of thermosetting resin during curing process and their applications of estimating internal stresses

热固性树脂固化过程中的本构关系及其在内应力估算中的应用

基本信息

项目摘要

Constitutive relations of thermosetting resin during curing process were formulated on the basis of experimental results of viscoelastic deformation and volume shrinkage for various temperature conditions. Internal stress of resin models induced by curing process were analyzed using formulated constitutive relations.1. Material properties of thermosetting resin during curing process(1) Volume shrinkages were experimentally measured during curing process under various temperature conditions.(2) High temperature curing resulted in rapid and large shrinkage.2. Constitutive relations of thermosetting resin during curing process(1) Creep deformations were experimentally measured during curing processes under various temperature conditions.(2) Experimental creep deformations were formulated by using non-linear viscoelastic models.3. Estimation of internal stress of resin models(1) Large internal stresses were induced by high temperature curing for two-layered composite models of the resin and metal plate.(2) Viscoelastic analysis gave better results than elastic analysis for the estimation of thermal deformation of the model.(3) Non-uniform temperature distribution induced large internal stresses for the resin n block of molding cavity comparing uniform temperature conditions.
根据不同温度条件下的粘弹性变形和体积收缩实验结果,建立了热固性树脂固化过程中的本构关系。利用已建立的本构关系,分析了固化过程中树脂模型的内应力。热固性树脂在固化过程中的材料性能:(1)在不同温度条件下,对固化过程中的体积收缩进行了实验测定。(2)高温固化导致收缩迅速且较大。热固性树脂固化过程中的本构关系(1)实验测量了不同温度条件下固化过程中的蠕变变形。(2)实验蠕变变形采用非线性粘弹性模型建立。树脂模型内应力的估算(1)树脂和金属板的双层复合材料模型在高温固化过程中会产生较大的内应力。(2)粘弹性分析比弹性分析对模型热变形的估算结果更好。(3)与均匀温度条件相比,温度分布不均匀导致成型腔树脂n块产生较大的内应力。

项目成果

期刊论文数量(18)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
仁内宏紀,佐藤千明,池上皓三: "熱硬化性樹脂の変動温度下での硬化過程に於ける体積変動率"材料. 48卷6号. 643-648 (1999)
Hiroki Niuchi、Chiaki Sato、Kozo Ikegami:“不同温度下热固性树脂固化过程中的体积变化率”材料,第 48 卷,第 6 期,643-648。
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Kozo Ikegami,Hiroshi Kawada: "Internal stress of epoxy resin induced by thermal history"Proc.Third International Congress on Thermal Stresses. 203-206 (1999)
Kozo Ikegami、Hiroshi Kawada:“热历史引起的环氧树脂内应力”Proc.第三届国际热应力大会。
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Kozo Ikegami,Hiroshi Kawada: "Internal stresses of epoxy resin induced b thermal history"Proceedings of the third international congress on thermal stresses. 203-206 (1999)
池上幸三、河田浩:《热历史引起的环氧树脂内应力》第三届国际热应力大会论文集。
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Kozo Ikegami: "Internal stress of thermosetting resin induced by curing process"Prceedings of the forty fifth congress of the Indian society of theoretical and applied mechanics. 1-8 (2000)
Kozo Ikegami:“固化过程引起的热固性树脂的内应力”印度理论与应用力学学会第四十五届大会论文集。
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宮入裕夫,中前勝彦,天野晋夫,池上皓三,笠野秀秋,越智光一: "先端接着接合技術"エヌジーテイー. 775 (2000)
Hiroo Miyairi、Katsuhiko Nakamae、Shino Amano、Kozo Ikegami、Hideaki Kasano、Koichi Ochi:“先进粘合技术”NGT 775 (2000)。
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IKEGAMI Kozo其他文献

IKEGAMI Kozo的其他文献

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{{ truncateString('IKEGAMI Kozo', 18)}}的其他基金

Constitutive relations of cyclic plasticity at low temperature
低温循环塑性本构关系
  • 批准号:
    09650089
  • 财政年份:
    1997
  • 资助金额:
    $ 0.83万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
Experimental Evaluation of Inelastic Constitutive Relation under Combined loading at Cryogenic Temperatures
低温联合载荷下非弹性本构关系的实验评估
  • 批准号:
    63550078
  • 财政年份:
    1988
  • 资助金额:
    $ 0.83万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (C)
General Aspects of Bonded Interfaces in Functional Adhesion
功能性粘合中键合界面的一般方面
  • 批准号:
    61460087
  • 财政年份:
    1986
  • 资助金额:
    $ 0.83万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)

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