General Aspects of Bonded Interfaces in Functional Adhesion

胶接是一种重要的连接技术。从力学和物理、化学两个方面对其作用进行了研究。提出了一种估算胶接零件强度的方法。通过实验验证了该方法的有效性。实验研究了胶接条件对胶接界面静态和动态性能的影响。得到了一种根据性能预测键合条件的方法。在弹塑性理论框架内分析了裂纹尖端的应力分布。对裂纹尺寸分布进行了参数研究。通过聚合工艺和内部结构考察了树脂的粘接性能。实验测定了复合陶瓷的收缩幅度。实验得到了复合陶瓷的收缩幅度。

Adhesive bonding is important joint technology. The functions are investigated from The points of Mechanical aspects as well as physical and chemical aspects.1. A method of estimating the strength of adhesive bonded parts was proposed. The validity of the method was confirmed by experimetnal procedures.2. The effects of adhesive bonding condition on static and dynamic properties of adhesive interface were experimentally investigated. A method of predicting bonding condition from the properties was obtained.3. The stress distributions at the tip of Crack were analysed within the framework of theory of elastoplasticity. The distributions uere parametrically studied with the crack dimensions.4. The adhesive properties of resin were investigated with polymerization process and internal structure.5. The shrinkage magnitudes in compounding ceramics were experimentally 5. The shrinkage magnitudes in compounding ceramics were experimentally obtained.