Thermal Conductivities of Complex Liquids Relevant to Process Modelling

该项目的目的是测量与工艺建模相关的金属、半导体和氧化物熔体的热导率，并讨论金属中的热传导机制。一种测量金属和半导体熔体导热系数的新方法的发展本文提出了一种用绝缘体涂层探头的非稳态热线法测量金属熔体导热系数的方法。对Hg和Pb熔体的测量值分别为8.2W/mK（室温）和15 W/mK（573 K），与文献值吻合较好.熔融Sn和Sn-In合金的热导率在600 K时测量的Sn的热导率为28 W/mK，并且随着温度的升高而略微增加。In的加入降低了材料的热导率及其温度依赖性. Wiedemann-Franz定律在高温下对金属的适用性Wiedemann-Franz定律是用自由电子的比热导出的 ...更多信息 n.提出了一个由电导率和电子比热估算金属高温热导率的新方程，其中电子比热是由实际金属的电子态密度计算的.熔融硅的热导率在1700 K时的测量值为57 W/mK，并随温度的升高而略有增加。在固体Si上测得的值为19 W/mK，1673 K刚好低于熔点。研究发现，Si的热导率在熔化时急剧增加。5.碱硅酸盐玻璃熔体的热导率用非稳态热线法测定了Li_2 O-SiO_2、Na_2 O-SiO_2和K_2 O-SiO_2三种玻璃熔体的热导率。随着碱金属半径的增大，导热系数降低。结果表明，碱金属离子与非桥氧离子之间的化学键越离子化，热导率越小.添加氟化物对碱硅酸盐玻璃熔体热导率的影响分别对含LiF和NaF的Li_2 O-SiO_2和Na_2 O-SiO_2熔体进行了测量。在这两种体系中，热导率随着氟化物的加入而降低。这种降低是由于氟破坏了硅酸盐的网络结构。少

The aim of this project was to measure thermal conductivities of metal, semiconductor and oxide melts relevant to process modelling and to discuss thermal conduction mechanisms in the metls.1. Development of a new method for measuring thermal conductivity of metal and semiconductor meltsThe nonstationary hot wire method with an insulator-coated probe has been developed to measure thermal conductivities for molten metals. Values measures on Hg and molten Pb are 8.2 W/mK at room temperature and 15 W/mK at 573 K, respectively, and are in good agreement with corresponding published values.2. Thermal conductivity of molten Sn and Sn-In alloysThe thermal conductivity measured on Sn is 28 W/mK at 600K and increases slightly with an increase in temperature. Additions of In result in a decrease in the thermal conductivity and its temperature dependence.3. Applicability of the Wiedemann-Franz law to metals at high temperatureThe Wiedemann-Franz law was derived using specific heat of free electro … More n. A new equation has been proposed to estimate thermal conductivity of metals at high temperature from electrical conductivity and electronic specific heat, the latter being calculated using the electron density of states for actual metals.4. Thermal conductivity of molten SiThe measured value is 57 W/mK at 1700 K and increases slightly with an increase in temperature. The value measured on solid Si is 19 W/mK at 1673 K just below the melting point. It has been found that the thermal conductivity of Si increases drastically on melting.5. Thermal conductivity of alkali silicate glass meltsThermal conductivities of Li_2O-SiO_2, Na_2O-SiO_2 and K_2O-SiO_2 melts were measured using the nonstationary hot wire method. The thermal conductivity decreases as the radius of alkali metals becomes larger. It has been condcluded that the thermal conductivity becomes smaller as the chemical bond between alkali and nonbridging oxygen ions is more ionic.6. Effect of fluoride additions to thermal conductivity of alkali silicate glass meltsMeasurements were carried out on Li_2O-SiO_2 and Na_2O-SiO_2 melts contained LiF and NaF, respectively. In both systems the thermal conductivities decrease with additions of the fluorides. This decrease would be due to breaking of the network structure of silicates by fluorine. Less