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Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress

热应力下各向异性异种材料界面裂纹的应力强度因子分析

基本信息

批准号：
12650091
负责人：
IKEDA Toru
金额：
$ 1.47万
依托单位：
Kyushu University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-12650091/
关键词：
Fracture Mechanics Interface Crack Stress Intensity Factor Thermal Stress Anisotropy Electronic Packaging Virtual Crack Extension Method 界面き裂異種材接合有限要素法

项目摘要

The stress intensity factors of an interface crack between dissimilar materials are important parameters for the evaluation of the integrity of electronic devices, adhesive structures and composite materials. We must use a numerical technique like the finite element method to analyze the stress intensity factors of an interface crack in an actual structure. In this study, we developed a numerical technique to analyze stress intensity factors of an interface crack between dissimilar materials under thermal stress. Final object of this study is to develop the anisotropic version of this method and the application to the evaluation of the reliability of electronic devices. We carried out several works as follows.(1) We modified the virtual crack extension method and the crack closure integral method for an interface crack between dissimilar materials under thermal stress condition. We demonstrated that the both methods is one of the most accurate methods to calculate the stress intensity factors of an interface crack.(2) The direction of the kinking of an interface crack can be predicted using the maximum hoop stress criterion that is derived from stress intensity factors of an interface crack.(3) We applied the stress intensity factors of an interface crack to evaluate the delamination between dissimilar materials used in semiconductor chips.(4) We developed a computer code to calculate the asymptotic solution of the stress distribution around an interface crack between dissimilar anisotropic materials using the Stroll formalism. This is the most important step to develop the numerical technique to calculate stress intensity factors of an interface crack between anisotropic dissimilar materials. We also derived the analytical solution of the stress intensity factors of a center interface crack between jointed semi-infinite anisotropic plates under uniform tension and shear.

异种材料界面裂纹的应力强度因子是评价电子器件、粘接结构和复合材料完整性的重要参数。要分析实际结构中界面裂纹的应力强度因子，必须使用类似有限元的数值方法。在这项研究中，我们发展了一种数值技术来分析热应力下不同材料之间的界面裂纹的应力强度因子。这项研究的最终目的是发展这种方法的各向异性版本，并将其应用于电子设备的可靠性评估。具体工作如下：(1)对热应力条件下异种材料界面裂纹的虚裂纹扩展方法和裂纹闭合积分方法进行了改进。我们证明这两种方法都是计算界面裂纹应力强度因子最准确的方法之一。(2)根据界面裂纹的应力强度因子推导出的最大环向应力准则可以预测界面裂纹的弯曲方向。(3)将界面裂纹的应力强度因子应用于评估半导体芯片中不同材料之间的分层。(4)开发了一个计算机程序，利用Stroll公式计算了不同各向异性材料之间界面裂纹周围的应力分布的渐近解。这是发展计算各向异性不同材料界面裂纹应力强度因子的数值方法的最重要的一步。给出了各向异性板在均布拉剪载荷作用下中心界面裂纹应力强度因子的解析解。