Improvement of elasticity of drawn gold bonding wire by texture control

通过织构控制提高拉制金键合线的弹性

基本信息

批准号：
12650718
负责人：
KANENO Yasuyuki
金额：
$ 2.3万
依托单位：
Osaka Prefecture University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

项目摘要

Gold wires with fine diameter of 〜20μm are widely used for bonding semiconductor devices. Due to the decrease of IC chip size, the development of gold wires with increased mechanical properties such as tensile strength and elasticity is required. For gold single crystal, it is known that Young's modulus of a crystallographic <111> direction is almost three times as much as that of a crystallographic <100> direction. It is therefore expected that ~ polycrystalline gold wires with high elasticity are available by texture control (i.e., fabrication of <111> orientated wires). In the present study, texture evolution during wire drawing and annealing of fine gold bonding wire was investigated by means of the orientation distribution function (ODF). Cold drawing texture of high-purity gold (99.999 wt.%) consisted of strong <111> and weak <100> fiber components below 99% reduction in area. Above 99% reduction in area, recrystallization occurred during wire-drawing process, resulting in increased <100> component. Cold drawing texture of gold wires with trace alloying elements (99.95 wt.% purity) also consisted of strong <111> and weak <100> fiber components similar to high-purity (99.999 wt.%) gold wires. However, for gold wires added trace alloying elements, recrystallization did not occur above 99% reduction in area, and thereby the <111> textural component retained beyond 99% reduction in area. Consequently, it is found that trace alloying addition to high-purity gold wire is useful for suppression of recrystallization during wire-drawing process and results in highly <111> orientated gold wires.

细直径约为20μm的金线被广泛用于粘结半导体设备。由于IC芯片大小的减小，需要增加机械性能（例如拉伸强度和弹性）的金线的发展。对于金单晶，众所周知，晶体学<111>方向的杨氏模量几乎是晶体学<100>方向的三倍。因此，预计可以通过纹理控制（即制造<111> <111>定向的电线）获得具有高弹性的多晶金线。在本研究中，通过方向分布函数（ODF）研究了电线绘制过程中的质地演变和高金键线的退火。高纯度黄金（99.999 wt。％）的冷图纹理由强<111>和弱<100>纤维组件组成，面积低于99％。降低面积高于99％，在绘制线绘制过程中发生重结晶，从而增加了<100>成分。带有痕量合金元件（99.95 wt。纯度）的金线的冷图纹理也由强<111>和弱<100>纤维组件组成，类似于高纯度（99.999 wt。％）金线。但是，对于添加了痕量合金元件的金线，重结晶的面积降低了99％，因此<111>质地成分保持在面积降低99％以上。因此，发现对高纯度金线的痕量合金添加可用于抑制线绘制过程中的再结晶，并导致高度<111>取向的金属丝。