Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.

细金铅与集成电路电焊盘极精细粘合机理分析。

• 批准号: 10450273
• 负责人: TAKAHASHI Yasuo
• 金额: $ 7.04万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B).
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-10450273/
• 关键词: Microjoining; Fine gold wire; Electric pad; Integrated circuit; Assembly Process; Bonding mechanism; Interfacial deformation; Numerical analysis; 電子実装; インナーリードボンディング; 常温接合; 空孔拡散; 接合強度; 残留応力

It is indispensable technology to develop the new microjoining used for the packaging process of IC and LSI of the electronics field. This is the basic technology which achieves the interconnection between integrated circuit electrodes and external leads such as the leadframe, and it is not the exaggeration. However, the materials used there are dissimilar to each other, and the optimization of the interconnection is not easy. Then, in the present study, the bonding mechanism between integrated circuit electrodes and gold fine wires and leads is analyzed and has been clarified from experiments and theoretical calculation results. Especially, material properties (difference between the mechanical properties of the gold fine lead/gold pad), transition of the bonding mechanism by the bonding load increase, the promoting effect of the wire deformation with the pad temperature increase, and the effects of the bonding tool shape on the interconnection formation, etc.were clarified. And also, … More the analysis for adhesional bonding mechanism at room temperature which is expected to be very important in the near future were carried out in the present study, and the increase phenomenon of the bond strength with the time after bonding was investigated and the mechanism was clarified. The results that were concretely obtained in the present study are classified into the following 8 points.1) The effect of material properties, bonding pressure, bonding temperature on the bonding process were analyzed.2) The analysis of the interfacial diffusion behavior between pad and fine wires and the change in the stress distribution with time.3) The transition of adhesional bonding mechanism with the bonding load increase.4) The numerical simulation of deformation process of pad and gold fine wire.5) The analysis of the effect of the bonding tool on the bonding process.6) Effect on the bonded interface extension of the pad thickness and effectiveness of the gold bump for the microjoining.7) Theory of adhesional bonding process between gold fine wire and pad, and also the quantification.8) Numerical examination of the bonded interface migration phenomenon and the abnormal formation of the grain boundary groove. Less

开发用于电子领域IC和LSI封装工艺的新型微连接是不可或缺的技术。这是实现集成电路电极与引线框架等外部引线互连的基础技术，并不夸张。然而，它们所使用的材料彼此不同，互连的优化并不容易。然后，在本研究中，分析了集成电路电极与金细线和引线之间的键合机制，并从实验和理论计算结果中阐明了这一机制。特别是，阐明了材料特性（金细引线/金焊盘的机械性能之间的差异）、键合负载增加引起的键合机制的转变、焊盘温度升高对引线变形的促进作用以及键合工具形状对互连形成的影响等。此外，本研究还对室温下的粘合机理进行了分析，研究了粘合强度随粘合时间的增加而增加的现象，并阐明了其机理。本研究具体得到的结果分为以下8点。1）分析了材料性能、键合压力、键合温度对键合过程的影响。2）分析了焊盘和细线之间的界面扩散行为以及应力分布随时间的变化。3）粘合键合机制随键合载荷增加的转变。4）焊盘和金细线变形过程的数值模拟 5）键合工具对键合过程的影响分析。6）焊盘厚度对键合界面延伸的影响以及金凸块对微连接有效性的影响。7）金细丝和焊盘之间的粘合键合过程理论及其定量。8）键合界面迁移现象和晶界凹槽异常形成的数值检验。较少的

项目成果

Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Thickness on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.2. 291-298 (1999)

Y.Takahashi、M.Inoue、K.Inoue：“细引线键合的数值分析 - 焊盘厚度对界面变形的影响 -”IEEE Trans.on CPT。

高橋康夫,上杉勝洋,松坂状太: "アルゴンイオン衝撃により表面活性化された金ワイヤと金箔との凝着接合に関する検討"Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

Yasuo Takahashi、Katsuhiro Uesugi、Shota Matsuzaka：“氩离子轰击激活的金线和金箔表面粘合的研究”Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Mechanical Properties on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.4. 558-566 (1999)

Y.Takahashi、M.Inoue、K.Inoue：“细引线键合的数值分析 - 焊盘机械性能对界面变形的影响 -”IEEE Trans.on CPT。

Yasuo Takahashi: "Numerical Study of Fine Lead and Wire Bonding in Electronic Packaging"Apack'99, Proceeding, Singapore 8th-10th 12月. 454-461 (1999)

Yasuo Takahashi：“电子封装中细引线和引线键合的数值研究”Apack99，Proceeding，新加坡，12 月 8 日至 10 日，454-461（1999 年）。

松坂壮太,高橋康夫,井上勝敬: "常温凝着接合における接合強度の時間依存性に関する研究"溶接学会論文集. 17. 583-588 (1999)

Sota Matsuzaka、Yasuo Takahashi、Katsutaka Inoue：“冷粘合中粘合强度的时间依赖性研究”日本焊接学会论文集 17. 583-588 (1999)。