Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.

细金铅与集成电路电焊盘极精细粘合机理分析。

• 批准号: 10450273
• 负责人: TAKAHASHI Yasuo
• 金额: $ 7.04万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B).
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-10450273/
• 关键词: Microjoining; Fine gold wire; Electric pad; Integrated circuit; Assembly Process; Bonding mechanism; Interfacial deformation; Numerical analysis; 電子実装; インナーリードボンディング; 常温接合; 空孔拡散; 接合強度; 残留応力

It is indispensable technology to develop the new microjoining used for the packaging process of IC and LSI of the electronics field. This is the basic technology which achieves the interconnection between integrated circuit electrodes and external leads such as the leadframe, and it is not the exaggeration. However, the materials used there are dissimilar to each other, and the optimization of the interconnection is not easy. Then, in the present study, the bonding mechanism between integrated circuit electrodes and gold fine wires and leads is analyzed and has been clarified from experiments and theoretical calculation results. Especially, material properties (difference between the mechanical properties of the gold fine lead/gold pad), transition of the bonding mechanism by the bonding load increase, the promoting effect of the wire deformation with the pad temperature increase, and the effects of the bonding tool shape on the interconnection formation, etc.were clarified. And also, … More the analysis for adhesional bonding mechanism at room temperature which is expected to be very important in the near future were carried out in the present study, and the increase phenomenon of the bond strength with the time after bonding was investigated and the mechanism was clarified. The results that were concretely obtained in the present study are classified into the following 8 points.1) The effect of material properties, bonding pressure, bonding temperature on the bonding process were analyzed.2) The analysis of the interfacial diffusion behavior between pad and fine wires and the change in the stress distribution with time.3) The transition of adhesional bonding mechanism with the bonding load increase.4) The numerical simulation of deformation process of pad and gold fine wire.5) The analysis of the effect of the bonding tool on the bonding process.6) Effect on the bonded interface extension of the pad thickness and effectiveness of the gold bump for the microjoining.7) Theory of adhesional bonding process between gold fine wire and pad, and also the quantification.8) Numerical examination of the bonded interface migration phenomenon and the abnormal formation of the grain boundary groove. Less

不可或缺的技术是开发用于电子领域IC和LSI包装过程的新微型加入。这是实现集成电路电子和外部线索（例如LeadFrame）之间互连的基本技术，这并不是夸张的。但是，那里使用的材料彼此不同，相互联系的优化并不容易。然后，在本研究中，分析了综合电路电子和金线和铅之间的键合机制，并从实验和理论计算结果中阐明了。尤其是，阐明了材料特性（金细铅/黄金垫的机械性能之间的差异），粘结载荷增加键合机制的过渡，随着垫子温度的增加而导线变形的促进效应以及粘结工具形状对互连形成的影响等。而且，……在室温下，在不久的将来进行的粘合键合机理的分析是在介绍研究中非常重要的，并且在研究了键合后的时间并阐明了键合的时间，并阐明了粘结强度的现象。分析了本研究中具体获得的结果分为以下8点。1）分析材料性能，粘结压力，粘结温度对键合过程的影响。2）分析板和细线之间的互化界面扩散行为的分析以及压力分布之间的界面扩散行为以及与时间的变化。 5）键合工具对键合过程的影响的分析。6）对微型粘结板厚度和粘结厚度的粘结界面扩展的影响。7）7）金金属丝和垫子之间的粘合键合过程以及数量之间的粘合键合过程。8）粘结界面的数值检查）键合界面迁移的数值迁移和构型范围构成了粒度的形成。较少的

项目成果

Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Thickness on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.2. 291-298 (1999)

Y.Takahashi、M.Inoue、K.Inoue：“细引线键合的数值分析 - 焊盘厚度对界面变形的影响 -”IEEE Trans.on CPT。

高橋康夫,上杉勝洋,松坂状太: "アルゴンイオン衝撃により表面活性化された金ワイヤと金箔との凝着接合に関する検討"Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

Yasuo Takahashi、Katsuhiro Uesugi、Shota Matsuzaka：“氩离子轰击激活的金线和金箔表面粘合的研究”Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Mechanical Properties on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.4. 558-566 (1999)

Y.Takahashi、M.Inoue、K.Inoue：“细引线键合的数值分析 - 焊盘机械性能对界面变形的影响 -”IEEE Trans.on CPT。

Yasuo Takahashi: "Numerical Study of Fine Lead and Wire Bonding in Electronic Packaging"Apack'99, Proceeding, Singapore 8th-10th 12月. 454-461 (1999)

Yasuo Takahashi：“电子封装中细引线和引线键合的数值研究”Apack99，Proceeding，新加坡，12 月 8 日至 10 日，454-461（1999 年）。

Y.TAKAHASHI,Souta Matsusaka,and K.INOUE: "Time Dependence of Room Temperature Bonding Strength" Proceeding of ECOMAP-98,. 533-536 (1998)

Y.TAKAHASHI、Souta Matsusaka 和 K.INOUE：“室温粘合强度的时间依赖性”ECOMAP-98 论文集。