Synthesis of Super-Hard Nano-Composite Films by High Density Plsama Sputtering

高密度等离子体溅射合成超硬纳米复合薄膜

• 批准号: 13305053
• 负责人: SHOJI Miyake
• 金额: $ 35.03万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13305053/
• 关键词: nanocomposite film; inductively coupled plsasma; high density plasma; ion bombardment; TiCuN; TiSiN; PVD; ナノコンポジット; 超硬質薄膜; 窒化物薄膜; スパッタリング; イオンビーム

1. The hardness of Ti-Cu-N nanocomposite films increased significantly from a value of about 22.8GPa for pure TiN films with the addition of a small amount of Cu, attained a maximum value of 42GPa at about 2 at.% Cu. The hardest Ti-Cu-N film was characterized as having nc-TiN/nc-Cu (not nc-TiN/a-Cu) nanocomposite structure, in which very tiny Cu crystallites (much smaller than TiN crystallites) dispersed between the nanocolumns of TiN crystallites. The biaxial compressive stress of the series of films was relatively low (<1.5GPa). Therefore, it was clarified that the superhardness of the hard/soft type of nanocomposite, which consists of a hard phase and a soft metal phase, does originate from a nanocomposite effect other than a high compressive stress2. The hardness of Ti-Si-N nanocomposite films increased significantly with the addition of a small amount of Si, reached a maximum value of 48GPa at about 5.8 at.% Si. The superhard Ti-Si-N films were characterized as having an nc-TiN/a-Si_3N_4 nanocomposite structures with a pronounced TiN(200) texture, where a-Si_3N_4 was assumed to segregate between nanocolumns of TiN crystallites. The hardening by the addition of Si was attributed to a nanocomposite effect. A simple theoretical calculation revealed

1.添加少量铜后，Ti-Cu-N纳米复合薄膜的硬度从纯TiN薄膜的22.8GPa左右显着增加，在约2at.%时达到最大值42 GPa Cu.最硬的Ti-Cu-N膜的特征在于具有nc-TiN/nc-Cu（而不是nc-TiN/a-Cu）纳米复合结构，其中非常微小的Cu微晶（比TiN微晶小得多）分散在TiN微晶的纳米柱之间。该系列薄膜的双轴压应力较低（<1.5GPa）。因此，它被澄清，由硬相和软金属相组成的硬/软类型的纳米复合材料的超硬度，不源于纳米复合效应而不是高压缩应力2。Ti-Si-N纳米复合薄膜的硬度随着Si含量的增加而显著提高，在Si含量为5.8at.%时达到最大值48 GPa Si. Ti-Si-N超硬薄膜具有nc-TiN/a-Si_3 N_4纳米复合结构，具有明显的TiN（200）织构，其中a-Si_3 N_4偏聚在TiN晶粒的纳米柱之间。通过添加Si的硬化归因于纳米复合效应。一个简单的理论计算显示，

项目成果

Structure refinement and hardness enhancement of titanium nitride addition of copper

氮化钛加铜的组织细化和硬度增强

• 发表时间: 2001
• 期刊: Surface and Coating Technology vol.137
• 作者: Z.G.Li;Z.G.Li;Z.G.Li;S.Miyake;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.LI;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.LI;Z.G.Li;Z.G.Li;Z.G.LI;J.L.He;J.L.He
• 通讯作者: J.L.He

Z.G.Li, S.Miyake, T.Tsumura: "Simulation of Nanoindentation Into Hard Thin Film on Soft Substrate"J.of High Temperature Society of Japan. 29. 152 (2003)

Z.G.Li、S.Miyake、T.Tsumura：“软基板上硬薄膜的纳米压痕模拟”日本高温学会杂志。

J.L.He, Y.Setsuhara, I.Shimizu, S.Miyake: "Structure refinement and hardness enhancement of titanium nitride films by addition of copper"Surface and Coating Technology. 137. 38-42 (2001)

J.L.He、Y.Setsuhara、I.Shimizu、S.Miyake：“通过添加铜来细化氮化钛薄膜的结构并增强硬度”表面和涂层技术。

Preparation of superhard nanocomposite films by ICP assisted magnetron sputtering

ICP辅助磁控溅射制备超硬纳米复合薄膜

• 发表时间: 2004
• 期刊: Proc. Int. Conf. on New Frontiers of Process Sci. and Eng. in Adv. Mater. (PSEA'04) (in press)
• 作者: K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;Z.G.Li;K.Osamura et al.;K.Osamura et al.;S.Miyake;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;T.Doi et al.;S.Miyake
• 通讯作者: S.Miyake

Z.G.Li, M.Mori, S.Miyake, M.Kumagai, T.Saito, Y.Muramatsu: "Structure and Properties of TiSiN Films Prepared by ICP Assisted Magnetron Sputtering with Low Energy Ion Bombatdment"The 4^<th> Asia-European International Conference on Plasma Surface Engineeri

Z.G.Li、M.Mori、S.Miyake、M.Kumagai、T.Saito、Y.Muramatsu：“ICP辅助磁控溅射低能离子轰击制备TiSiN薄膜的结构和性能”第4届亚洲-