Synthesis of Super-Hard Nano-Composite Films by High Density Plsama Sputtering
Synthesis of Super-Hard Nano-Composite Films by High Density Plsama Sputtering
高密度等离子体溅射合成超硬纳米复合薄膜
批准号：
13305053
负责人：
SHOJI Miyake
金额：
$35.03万
依托单位：
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2001
资助国家：
日本
项目状态：
已结题
起止时间：
2001 至 2003
中文摘要
翻译
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英文摘要
1. The hardness of Ti-Cu-N nanocomposite films increased significantly from a value of about 22.8GPa for pure TiN films with the addition of a small amount of Cu, attained a maximum value of 42GPa at about 2 at.% Cu. The hardest Ti-Cu-N film was characterized as having nc-TiN/nc-Cu (not nc-TiN/a-Cu) nanocomposite structure, in which very tiny Cu crystallites (much smaller than TiN crystallites) dispersed between the nanocolumns of TiN crystallites. The biaxial compressive stress of the series of films was relatively low (<1.5GPa). Therefore, it was clarified that the superhardness of the hard/soft type of nanocomposite, which consists of a hard phase and a soft metal phase, does originate from a nanocomposite effect other than a high compressive stress2. The hardness of Ti-Si-N nanocomposite films increased significantly with the addition of a small amount of Si, reached a maximum value of 48GPa at about 5.8 at.% Si. The superhard Ti-Si-N films were characterized as having an nc-TiN/a-Si_3N_4 nanocomposite structures with a pronounced TiN(200) texture, where a-Si_3N_4 was assumed to segregate between nanocolumns of TiN crystallites. The hardening by the addition of Si was attributed to a nanocomposite effect. A simple theoretical calculation revealed
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Structure refinement and hardness enhancement of titanium nitride addition of copper
氮化钛加铜的组织细化和硬度增强
氮化钛加铜的组织细化和硬度增强
DOI：
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发表时间：
2001
期刊：
Surface and Coating Technology vol.137
影响因子：
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作者：
[Z.G.Li, Z.G.Li, Z.G.Li, S.Miyake, Z.G.Li, Z.G.Li, Z.G.Li, Z.G.Li, Z.G.LI, Z.G.Li, Z.G.Li, Z.G.Li, Z.G.LI, Z.G.Li, Z.G.Li, Z.G.LI, J.L.He, J.L.He]
通讯作者：
J.L.He
Z.G.Li, S.Miyake, T.Tsumura: "Simulation of Nanoindentation Into Hard Thin Film on Soft Substrate"J.of High Temperature Society of Japan. 29. 152 (2003)
Z.G.Li、S.Miyake、T.Tsumura：“软基板上硬薄膜的纳米压痕模拟”日本高温学会杂志。
Z.G.Li、S.Miyake、T.Tsumura：“软基板上硬薄膜的纳米压痕模拟”日本高温学会杂志。
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J.L.He, Y.Setsuhara, I.Shimizu, S.Miyake: "Structure refinement and hardness enhancement of titanium nitride films by addition of copper"Surface and Coating Technology. 137. 38-42 (2001)
J.L.He、Y.Setsuhara、I.Shimizu、S.Miyake：“通过添加铜来细化氮化钛薄膜的结构并增强硬度”表面和涂层技术。
J.L.He、Y.Setsuhara、I.Shimizu、S.Miyake：“通过添加铜来细化氮化钛薄膜的结构并增强硬度”表面和涂层技术。
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Preparation of superhard nanocomposite films by ICP assisted magnetron sputtering
ICP辅助磁控溅射制备超硬纳米复合薄膜
ICP辅助磁控溅射制备超硬纳米复合薄膜
DOI：
--
发表时间：
2004
期刊：
Proc. Int. Conf. on New Frontiers of Process Sci. and Eng. in Adv. Mater. (PSEA'04) (in press)
影响因子：
--
作者：
[K.Osamura et al., K.Osamura et al., K.Osamura et al., K.Osamura et al., Z.G.Li, K.Osamura et al., K.Osamura et al., S.Miyake, K.Osamura et al., Z.G.Li, K.Osamura et al., Z.G.Li, K.Osamura et al., Z.G.Li, K.Osamura et al., T.Doi et al., S.Miyake]
通讯作者：
S.Miyake
Z.G.Li, M.Mori, S.Miyake, M.Kumagai, T.Saito, Y.Muramatsu: "Structure and Properties of TiSiN Films Prepared by ICP Assisted Magnetron Sputtering with Low Energy Ion Bombatdment"The 4^<th> Asia-European International Conference on Plasma Surface Engineeri
Z.G.Li、M.Mori、S.Miyake、M.Kumagai、T.Saito、Y.Muramatsu：“ICP辅助磁控溅射低能离子轰击制备TiSiN薄膜的结构和性能”第4届亚洲-
Z.G.Li、M.Mori、S.Miyake、M.Kumagai、T.Saito、Y.Muramatsu：“ICP辅助磁控溅射低能离子轰击制备TiSiN薄膜的结构和性能”第4届亚洲-
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