Mechanical Characterization of Ni-Based Alloy Thin Film by SPM Tensile Testing

通过 SPM 拉伸测试对镍基合金薄膜进行机械表征

• 批准号: 13650106
• 负责人: ISONO Yoshitada
• 金额: $ 2.56万
• 依托单位: Ritsumeikan University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650106/
• 关键词: Scanning probe microscope; Nickel thin film; Tensile test; Young's modulus; Constitutive equations; Permallov; Masuietic domain Dattern; AFM; ポアソン比; 磁区

This research investigated mechanical characteristics of micro scale single crystal silicon (SCS) and UV-LIGA Nickel (Ni) films used for micro electromechanical systems (MEMS). Compact tensile tester operated in Scanning Probe Microscope (SPM) was developed for accurate evaluation of Young's modulus, tensile strain, and strength of microscale SCS and UV-LIGA Ni specimens. SCS specimens with nominal dimensions of 20 pm in thickness, 50 p.m in width, and 600 pm in length were prepared by a conventional photolithography and etching processes. UV-LIGA Ni specimens, with a thickness of 15 pm, a width of 50 pm, and a length of 600 p.m in nominal dimensions, were also fabricated by electroplating using a UV thick photoresist mold. All specimens have line patterns on their specimen gauge section to measure axial elongation under tensile stressing. The SCS specimens showed linear stress-strain relation and brittle fracture, whereas the UV-LIGA Ni specimens produced elastic-inelastic deformation … More behavior.Young's modulus of SCS and UV-LIGA Ni specimens obtained from tensile tests averaged 169.2 GPa and 183.6 GPa, respectively, which closed to those of the bulk materials. However, ultimate tensile strength of both materials showed larger value than that in bulk, 1.47 GPa for SCS and 0.98 GPa for Ni specimens. Yield stress and breaking elongation of UV-LIGA Ni specimens were also quite different from those of buLk Ni.Mechanical properties of the UV-LIGA Ni specimens were also studied at elevated temperatures to propose a simple constitutive equation on the assumption that the total strain increment was a linear superposition of elastic, plastic and creep strain increments. An optimum design of the micro connector by finite element analyses has been performed using the constitutive equations.Finally, magnetic domain pattern of permalloy thin films, which were know to be Ni-based alloy, was measured by magnetic force microscope (MEM) to reveal the effect of film thickness on the width of domain walls. Domain walls increased with a reduction of film thickness, which was caused by the transition of domain walls from Block type to Cross-tie type. Less

研究了用于微机电系统（MEMS）的微尺度单晶硅（SCS）和UV-LIGA镍（Ni）薄膜的力学特性。研制了一种在扫描探针显微镜（SPM）上工作的小型拉伸试验机，用于精确评估微型SCS和UV-LIGA Ni试样的杨氏模量、拉伸应变和强度。SCS样品的标称尺寸为20 μ m的厚度，50 μ m的宽度，和600 μ m的长度，通过常规的光刻和蚀刻工艺制备。UV-LIGA Ni试样，具有15 μ m的厚度，50 μ m的宽度，和600 μ m的长度在标称尺寸，也通过电镀使用UV厚的光致抗蚀剂模具制造。所有试样在其试样量规截面上都有线型，用于测量拉伸应力下的轴向伸长率。SCS试样呈现线性应力-应变关系，脆性断裂，而UV-LIGA Ni试样呈现弹性-非弹性变形 ...更多信息 从拉伸试验获得的SCS和UV-LIGA Ni试样的杨氏模量平均值分别为169.2GPa和183.6GPa，其接近于块体材料的杨氏模量。然而，两种材料的极限抗拉强度显示出较大的值比在散装，1.47 GPa的SCS和0.98 GPa的Ni试样。UV-LIGA Ni试样的屈服应力和断裂伸长率也与普通Ni试样有很大的不同。本文还研究了UV-LIGA Ni试样在高温下的力学性能，并假设总应变增量是弹性、塑性和蠕变应变增量的线性叠加，提出了一个简单的本构方程。最后，利用磁力显微镜（MEM）测量了坡莫合金薄膜（已知为镍基合金）的磁畴图案，揭示了薄膜厚度对磁畴壁宽度的影响。随着薄膜厚度的减小，畴壁逐渐增大，这是由于畴壁由块状畴向十字形畴转变所致。少

项目成果

Yeonkyeong Lee, Tada Junichi, Yoshitada Isono: "Mechanical Characterization of Single Crystal Silicon and UV-LIGA Nickel Thin Films Using Tensile Tester Operated in AFM"Fatigue and Fracture of Engineering Materials and Structures. (to be submitted).

Yeonkyeong Lee、Tada Junichi、Yoshitada Isono：“使用 AFM 中操作的拉伸测试仪对单晶硅和 UV-LIGA 镍薄膜进行机械表征”工程材料和结构的疲劳和断裂。

Yoshitada Isono, Junichi Tada, Toshiyuki Watanabe, Toshinori Unno, Toshiyuki Toriyama, Susumu Sugiyama: "Elevated Temperature Tensile/Creep Test of UV-LIGA Nickel Thin Film for Design of High-Density Micro Connector"Proc. of The 12th International Confere

Yoshitada Isono、Junichi Tada、Toshiyuki Watanabe、Toshinori Unno、Toshiyuki Toriyama、Susumu Sugiyama：“用于高密度微型连接器设计的 UV-LIGA 镍薄膜的高温拉伸/蠕变测试”Proc。

Yoshitada Isono, Junichi Tada, Toshiyuki Watanabe, Toshinori Unno, Toshiyuki Toriyama, Susumu Sugiyama: "Elevated Temperature TensilelCreep Test of UY-LIGA Nickel Thin Film for Design of High-Density Micro Connector"Proc. of The 12th International Confere

Yoshitada Isono、Junichi Tada、Toshiyuki Watanabe、Toshinori Unno、Toshiyuki Toriyama、Susumu Sugiyama：“用于高密度微型连接器设计的 UY-LIGA 镍薄膜的高温拉伸蠕变测试”Proc。

Yeonkyeong Lee, Tada Junichi, Yoshitada Isono: "Mechanical Characterization of Single Crystal Silicon and UV-LIGA 'Nickel Thin Films Using Tensile Tester Operated in AFM"Fatigue and Fracture of Engineering Materials and Structures, Blackwell Publishing. (

Yeonkyeong Lee、Tada Junichi、Yoshitada Isono：“使用 AFM 中操作的拉伸测试仪对单晶硅和 UV-LIGA 镍薄膜进行机械表征”工程材料和结构的疲劳和断裂，Blackwell 出版社。

Y.Isono, T.Namazu N.Terayama, T.Tanaka: "Mechanical Characterization of Sub-micrometer Thick DLC Films by AFM Tensile Testing for Surface Modification in MEMS"Proc. of the 15th IEEE International Conference on MEMS 2002,IEEE. 431-434 (2002)

Y.Isono、T.Namazu N.Terayama、T.Tanaka：“通过 AFM 拉伸测试对 MEMS 中的表面改性进行亚微米厚 DLC 薄膜的机械表征”Proc。