Crystallographic Evaluation of Ultrathin SOI Substrates and Impurity Diffusion Modeling for Nanometer LSIs
Crystallographic Evaluation of Ultrathin SOI Substrates and Impurity Diffusion Modeling for Nanometer LSIs
批准号:
14550323
负责人:
ARAI Eisuke
金额:
$2.3万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2004
中文摘要
点击翻译按钮获取中文摘要
英文摘要
1.Crystalline Quality Evaluation of SOI Substrates(1)Changes of Carrier Density Distribution in SOI Substrates with AnnealingCarrier distribution changes in SOI substrates with annealing were measured. The changes depend on both Si layer thickness of SOI substrates and annealing temperature. For Si layer thicker than 1 μm, the inversion layer is generated with annealing near 1000℃ at the buried oxide interface of p-type SOI substrates, while the accumulation layer is generated at the interface of n-type SOI substrates.. For Si layer thinner than 1 μm, n-type donor is generated with annealing of 700-800℃. The donor level is below 0.03eV and the origin of the donor is considered to be due to the oxygen precipitation, i.e., so-called new donor.(2)Electrical Characteristics Evaluation of Buried Oxide (BOX) Interfacethe carrier recombination velocity of BOX interface was measured using μ-PCD method. The velocity is 500-1800 cm/s which is about 100 times larger than that for the conventional … More interface of Si and thermal silicon oxide.2.Impurity Diffusion Modeling for SOI Substrates(1)Comparison of B Diffusion Profiles in 3 kinds of Ultrathin SOI SubstratesB diffusion profiles in 3 kinds of ultra-thin SOI substrates (SIMOX, UNIBOND and ELTRAN) were compared. The diffusion depths in the SOI substrates were shallower than those in bulk Si and the depth in SIMOX is the shallowest among 3kinds of SOI substrates. These results show the crystalline quality of BOX interface and the recombination velocity of point defects at the interface is the fastest for SIMOX substrates.(2)Accuracy of Process Simulator on the Market and Diffusion ModelingFrom the B and P predeposition profiles in bulk Si and SOI substrates, diffusion parameters for simulation were extracted. Using the parameters, the drive-in diffusion profiles were simulated using the process simulator on the market and compared with experimental profiles. The experimental profiles are deeper than those simulated, which suggests that the diffusion enhancement mechanism in drive-in process should be taken in the process simulator. Less
期刊论文(18)
专著(0)
科研奖励(0)
会议论文
登录
查看更多内容
Sb Pile-up at Oxide and Si Interface during Drive-in Process after Predeposition Using Doped Oxide Source
使用掺杂氧化物源预沉积后推进过程中氧化物和硅界面处的 Sb 堆积
DOI:
--
发表时间:
2003
期刊:
Jpn.J.Appl.Phys. 42
影响因子:
--
作者:
[T.Ichino, H.Uchida, M.Ichimura, E.Arai]
通讯作者:
E.Arai
Applicability of Phosphorus and Boron Diffusin Parameters Extracted from Predeposition to Drive-in Diffusion for Bulk Si and Silicon-on-Insulaor
从预沉积提取的磷和硼扩散参数对块状硅和绝缘体上硅的驱入扩散的适用性
DOI:
--
发表时间:
2003
期刊:
Jpn.J.Appl.Phys. 42
影响因子:
--
作者:
[E.Arai, D.Iida, H.Asai, Y.Ieki, H.Uchida, M.Ichimura]
通讯作者:
M.Ichimura
Applicability of Phosphorus and Boron Diffusion Parameters Extracted from Predeposition to Drive-in Diffusion for Bulk Si and Silicon-on-Insulator
从预沉积提取的磷和硼扩散参数对体硅和绝缘体上硅的驱入扩散的适用性
DOI:
--
发表时间:
2002
期刊:
Jpn.J.Appl.Phys. 42
影响因子:
--
作者:
[E.Arai, D.Iida, H.Asai, Y.Ieki, H.Uchida, M.Ichimura]
通讯作者:
M.Ichimura
As and Sb diffusion profiles in thin silicon-on-insulator
薄绝缘体上硅中的 As 和 Sb 扩散分布
DOI:
--
发表时间:
2002
期刊:
Extended Abstracts of the 3^<rd> International Workshop on Junction Technology
影响因子:
--
作者:
[Y.Shibata, M.Ichimura, E.Arai]
通讯作者:
E.Arai
T.Ichino, H.Uchida, M.Ichimura, E.Arai: "Sb Pile-up at Oxide and Si Interface during Drive-in Process after Predeposition Using Doped Oxide Source"Jpn. J. Appl. Phys.. 42(掲載予定). (2003)
T.Ichino、H.Uchida、M.Ichimura、E.Arai:“使用掺杂氧化物源进行预沉积后,氧化物和硅界面处的 Sb 堆积”Jpn. J. Appl. 42 (计划)。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
共 18 条
Modeling of Impurity Diffusion in SOI Substrates for Future LSIs
-
批准号:10650334
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.37万
-
财政年份:1998
-
负责人:ARAI Eisuke
-
依托单位:
海外基金