Analysis, simulation, fabrication and characterization of reliable, robust and scalable compact cooling elements based on semiconductor nanostructures

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Modern electronic, microelectronic and optoelectronic devices generally work better when they are cooler. We aim to develop a semiconductor nanostructure cooling element which directly integrates into existing devices. The solid-state cooling element will be reliable, robust, scalable and operate in any orientation. The basis of operation is thermionic emission - electrons are the working fluid. Our project combines (1) analysis and simulation, (2) fabrication of nanostructures and (3) experimental test-benching using optical and electrical methods. The outcome of this research has the potential to revolutionize cooling of modern electronic and photonic systems, from computer motherboards to mobile phones.