Creep-Fatigue Life Evaluation for Lead-Free Solder Connections in Electronic Devices

近年来，随着电子设备的高密度安装，温度升高，电子设备的运行条件变得越来越严峻。电子设备中的焊点是电子设备质量保证的关键部分，迫切需要焊点的质量保证。因此，为了保证焊点的质量，需要开发一种适用于焊点的准确、高效的疲劳寿命估算方法。根据锡-3.5Ag焊料的疲劳试验结果，提出了一种估算锡-3.5Ag焊料疲劳寿命的方法。

In recent years, operating condition of electronic devices is becoming increasingly severe due to the temperature raise with high density mounting of electronic devices. Solder connections in electronic devices are a key part for the quality assurance of electronic devices and the quality assurance of solder connection is strongly needed. Therefor, development of an accurate and efficient fatigue life estimation method applicable to solders is needed for the quality assurance of solder connections. In this study, a fatigue life estimation method for Sn-3.5Ag solder was developed based on the results of fatigue test using Sn-3.5Ag solder.