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Study on an evaluation technique for millimeter-wave circuit substrate materials

毫米波电路基板材料评价技术研究

基本信息

批准号：
20560289
负责人：
KOGAMI Yoshinori
金额：
$ 3万
依托单位：
Utsunomiya University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2008
资助国家：
日本
起止时间：
2008 至 2010
项目状态：
已结题

项目摘要

In design of millimeter-wave planar circuits, it is necessary to evaluate the copper-clad substrates. The relative permittivity of the insulator and the surface resistance of the copper should be measured at the millimeter-wave frequency band. Most of the insulator for the circuit substrate consist of the laminated glass-cloth sheets which are contained the low-loss plastic resin. Therefore, its relative permittivity has anisotropy generally for their dielectric properties. The circuit substrate suppliers, however, hardly show us data of the anisotropic permittivity in their catalog. The circuit designers frequently are troubled with the disagreement between the measured and pre-estimated results for the test-manufactured circuits or devices.On the other hand, for the conductor properties, the influence of the boundary situation between the insulator and the copper film on its effective conductivity should be evaluated to estimate the conductor loss of the designed circuits.In this study, we investigate a measurement method to evaluate the anisotropy of the relative permittivity of the dielectric laminate substrates using Whispering-Gallery mode dielectric resonator method, at first. Some dielectric substrate materials are measured in the 50 to 75 GHz band and the anisotropic relative permittivities are evaluated. The measured results of the relative permittivitiy in planar direction are compared with the measured results by the cut-off cylindrical wave guide method. Secondary, we investigate the measurement techniques to evaluate the millimeter-wave surface resistance of the conductor materials.

在毫米波平面电路设计中，需要对覆铜基板进行评价。绝缘体的相对介电常数和铜的表面电阻应在毫米波频段测量。电路基板的绝缘体大多由含有低损耗塑料树脂的层压玻璃布片组成。因此，其相对介电常数一般具有各向异性的介电性质。然而，电路基板供应商在其目录中几乎没有向我们展示各向异性介电常数的数据。电路设计者经常为试制电路或器件的测量结果与预估结果之间的不一致而感到困扰。另一方面，对于导体特性，需要评估绝缘体与铜膜之间的边界位置对其有效电导率的影响，以估计设计电路的导体损耗。在本研究中，本文首先研究了一种利用回音壁模式介质谐振器测量介质叠层基板相对介电常数各向异性的方法。在50 ~ 75 GHz频段测量了一些介质基片材料的各向异性相对介电常数。并将平面方向相对折射率的测量结果与截断圆柱波导法的测量结果进行了比较。其次，我们研究了测量技术来评估导体材料的毫米波表面电阻。