Dynamic wetting behavior involving recovery of oxide droplet

涉及氧化物液滴回收的动态润湿行为

• 批准号: 20860054
• 负责人: NAKAMOTO Masashi
• 金额: $ 1.64万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (Start-up)
• 财政年份: 2008
• 资助国家: 日本
• 起止时间: 2008 至 2009
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-20860054/
• 关键词: 界面物性; 酸化物融体; 濡れ性; 界面張力; 界面反応; 表面張力

Dynamic wetting behavior involving recovery of Na_2O-SiO_2 droplet on solid Cu substrate was investigated by conducting wetting experiment with Pt or Au substrate instead of Cu substrate in order to attempt understand the mechanism of the dynamic wetting behavior. The dynamic wetting behavior on Pt or Au substrate was not observed. Thus, it was concluded that the behavior presumably attributes to the variation of interfacial tension between Na_2O-SiO_2 droplet and solid Cu substrate due to the movements of Cu between those two substances.

为了研究Na_2 O-SiO_2液滴在Cu基片上的动态润湿行为，采用Pt或Au基片代替Cu基片进行润湿实验。在Pt或Au衬底上没有观察到动态润湿行为。这可能是由于Cu在Na_2 O-SiO_2液滴与Cu基体之间的移动引起了液滴与Cu基体之间界面张力的变化。

项目成果

CO2-CO雰囲気下における固体Cu上のSiO2-Na2O液滴の動的濡れ挙動

CO2-CO气氛下SiO2-Na2O液滴在固体Cu上的动态润湿行为

• 发表时间: 2009
• 作者: 中本将嗣;山本高郁;Marko Hamalainen;Lauri Holappa
• 通讯作者: Lauri Holappa

CO_2-CO雰囲気下における固体Cu上のSiO_2-Na_2O液滴の動的濡れ挙動

CO_2-CO气氛下SiO_2-Na_2O液滴在固体Cu上的动态润湿行为

• 发表时间: 2009
• 作者: Apoorva Kulkarni;Shareghe Mehraeen;Bryan W.Reed;Norihiko L.Okamoto;Nigel D.Browning;Bruce C.Gates;弓削是貴;中本将嗣
• 通讯作者: 中本将嗣