Micro Milling of Sapphire

研究蓝宝石的微切割以制造在极高压力和/或温度下的特殊环境中使用的微型器件。因为蓝宝石是六方晶体材料，所以切削力和临界切削深度（完成无裂纹表面的最大深度）取决于晶面和相对于晶轴的切削方向。在蓝宝石铣削加工中，切削条件的确定应考虑脆性断裂和表面光洁度的粘附。通过逐步确定切削深度的分解过程，减少了材料的粘附。

Micro cutting of sapphire is studied to manufacture micro devices used in special environments at extremely high pressures and/or temperatures. Because sapphire is a hexagonal crystal material, the cutting force and the critical cutting depth, the maximum depth in which crack-free surfaces are finished, depends on the crystal plane and the cutting direction with respect to the crystal axis. In milling of sapphire, brittle fracture and adhesion of the surface finish should be considered in determination of the cutting conditions. The adhesion of material is reduced by the decomposed process, in which the cutting depth is given incrementally.