Micro Milling of Sapphire

蓝宝石的微切削是为了在极高的压力和/或温度下制造在特殊环境中使用的微型器件而进行的。由于蓝宝石是一种六方晶体材料，切削力和临界切深，即加工无裂纹表面的最大深度，取决于晶面和相对于晶轴的切割方向。在加工蓝宝石时，在确定切割条件时，应考虑表面的脆性断裂和粘附性。材料的附着力通过分解过程来降低，在分解过程中，切割深度递增。

Micro cutting of sapphire is studied to manufacture micro devices used in special environments at extremely high pressures and/or temperatures. Because sapphire is a hexagonal crystal material, the cutting force and the critical cutting depth, the maximum depth in which crack-free surfaces are finished, depends on the crystal plane and the cutting direction with respect to the crystal axis. In milling of sapphire, brittle fracture and adhesion of the surface finish should be considered in determination of the cutting conditions. The adhesion of material is reduced by the decomposed process, in which the cutting depth is given incrementally.