Study on temperature rise of printed circuit boards havingdifferent thermal conductivity values across a board

本文介绍了电子设备热设计中印刷电路板（PCB）有效导热系数的计算方法。为了计算PCB的面内有效导热系数，我们利用扩散电阻方程定义了两种类型的热阻。一个是作为铜线和基底材料的热导率的函数的热阻，另一个是有效热导率的热阻。当铜线在面内方向上的热扩散半径为26.5mm时，由铜线导热系数和基材导热系数计算的热阻与实验结果基本吻合，而当一维热阻项乘以0.45时，由有效导热系数计算的热阻与实验结果吻合较好。因此，可以通过所提出的方程来计算PCB的面内有效导热系数

This paper describes an evaluation of effective thermal conductivities of Printed CircuitBoards (PCBs) for thermal design of electronic equipment. To formulate the in-plane effectivethermal conductivity of the PCBs, we define two types of a thermal resistance by usingspreading resistance equation. One is the thermal resistance as a function of the thermalconductivity of copper wire and of base material, and the other is that of effective thermalconductivities. The thermal resistance by using the thermal conductivity of copper wire and ofbase material is almost matched with experimental results when heat diffusion radius inin-plane direction by copper wire is about 26.5 mm. On the other hand, the thermal resistanceby using effective thermal conductivities is in good agreement with experimental results whenwe multiply 1D thermal resistance term in the proposed equation by 0.45. Therefore, in-planeeffective thermal conductivity of the PCBs can be evaluated by using proposed equations