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Development of the thermal design approach for electronic equipment incorporated with electric design and CFD software.

开发结合电气设计和 CFD 软件的电子设备热设计方法。

基本信息

批准号：
16560190
负责人：
ISHIZUKA Masaru
金额：
$ 1.34万
依托单位：
Toyama Prefectural University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2005
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16560190/
关键词：
computational fluid dynamics (CFD)thermal design switch mode power supply incorporation with electric design and thermaldesign modeling of components estimation of amount of dissipated heat 電子機器の熱設計電機設計との統合熱流体シミュレーションパワー半導体

项目摘要

In the design process of electronic equipments early estimates of component temperatures are of great importance. Many tools exist to assist thermal design engineers during this process, including flow network modeling (FNM), computational fluid dynamics (CFD), and well-established heat transfer correlations, and the thermal flow simulation technique is applied to thermal design in the development phase of electronic equipment.In many electronic equipment, several coil components, such as a transformer and a high-frequency inductor are used and it is a one of the most important component for thermal design. Therefore, in order to improve the accuracy of thermal flow simulation, the coil component needs to be accurately analyzed together with the other components within a single numerical model. However, regarding the system-level thermal simulation, there are few reports in which the detail of modeling method for coil component is documented. The purpose of this study is to develop the … More compact thermal modeling method of coil component applicable to the system-level thermal flow simulation. This study especially focused on high-frequency inductor as the coil component.In the proposed modeling method, the effect of proximity-effect loss occurs near the air gap on winding surface temperature was considered. Additionally, the effect of anisotropic thermal conductivity in a winding block on the winding surface temperature was considered. In this study the first step is the measurement of the winding surface temperature distribution of an experimental dummy inductor that imitates proximity loss occurring locally near an air gap in order to confirm the influence of proximity loss on the winding surface temperature distribution. Next, we conducted a numerical simulation of the experimental dummy inductor winding surface temperature.As a key point in the numerical modeling, the significance of considering the influence of the proximity-effect loss and the anisotropic thermal conductivity on the winding surface temperature was demonstrated experimentally and numerically. Less

在电子设备的设计过程中，早期估计元件温度是非常重要的。在此过程中，存在许多工具来帮助热设计工程师，包括流网络建模（FNM）、计算流体动力学（CFD）和成熟的传热相关性，并且在电子设备的开发阶段将热流模拟技术应用于热设计。在许多电子设备中，几个线圈组件，例如Transformer和高频电感器，并且它是热设计的最重要的部件之一。因此，为了提高热流模拟的准确性，需要在单个数值模型内与其他部件一起准确地分析线圈部件。然而，关于系统级热仿真，有几个报告中，详细的建模方法，线圈组件的文件。本研究的目的是开发 ...更多信息一种适用于系统级热流仿真的线圈组件紧凑热建模方法。本研究特别针对高频电感作为线圈元件，考虑了气隙附近邻近效应损耗对绕组表面温度的影响。此外，还考虑了绕组块各向异性导热系数对绕组表面温度的影响。在这项研究中，第一步是测量的绕组表面温度分布的实验虚拟电感器，模仿接近损失发生局部附近的气隙，以确认接近损失对绕组表面温度分布的影响。其次，对实验用虚拟电感线圈表面温度进行了数值模拟，作为数值模拟的关键，从实验和数值两方面论证了考虑邻近效应损耗和各向异性导热系数对线圈表面温度影响的重要性。少