Development of strain measurement system in microscopic area using EBSD method

本研究对厚度为100μm、缺口直径为0.5 mm的纯铜薄膜进行了疲劳实验，观察到了滑移等疲劳损伤。此外，根据EBSD(电子背散射衍射法)获得的晶体取向矩阵，计算了晶体的取向误差和取向误差。结果表明，随着疲劳试验的进行，铜薄膜中几乎所有颗粒的取向不均角都增大。在产生滑移线的晶体中，疲劳试验时取向不均的轴线偏向同一方向，而静载时则偏向散布方向。从偏向轴元件的变化来看，偏向轴向加载方向的横向倾斜并且朝向薄膜的面。随后，轴向加载方向移动，并启动了滑移线。

In this study, the pure copper film of 100μm thickness with a 0.5mm notch hole was fatigued and the fatigue damage such as a slip initiation was observed. Moreover, a misorientation and a misorientation axis were computed from crystal orientation matrices obtained by using the EBSD (Electron Backscatter Diffraction) method. As a result, a misorientation angle increased with fatigue testing in almost all the grains of the copper film. In the crystal grain in which slip lines are generated, misorientation axes are inclined to the same direction by fatigue testing, while those turn to a scattering directions for the static loading. From the change of a misorientation axis element, the misorientation axes are inclined toward the transverse direction to the loading direction and in face of the film. Subsequently, the axes tended to the loading direction and the slip lines were initiated.