Development of strain measurement system in microscopic area using EBSD method

利用EBSD法开发微观区域应变测量系统

• 批准号: 22560081
• 负责人: SHIMIZU Kenichi
• 金额: $ 2.91万
• 依托单位: Okayama University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2010
• 资助国家: 日本
• 起止时间: 2010 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-22560081/
• 关键词: ひずみ; 金属膜材; EBSD; 疲労; 疲労損傷; EBSD法; 結晶方位差; すべり変形; 疲労き裂; 銅膜材; き裂; 電子線後方散乱回折; き裂開口変位

In this study, the pure copper film of 100μm thickness with a 0.5mm notch hole was fatigued and the fatigue damage such as a slip initiation was observed. Moreover, a misorientation and a misorientation axis were computed from crystal orientation matrices obtained by using the EBSD (Electron Backscatter Diffraction) method. As a result, a misorientation angle increased with fatigue testing in almost all the grains of the copper film. In the crystal grain in which slip lines are generated, misorientation axes are inclined to the same direction by fatigue testing, while those turn to a scattering directions for the static loading. From the change of a misorientation axis element, the misorientation axes are inclined toward the transverse direction to the loading direction and in face of the film. Subsequently, the axes tended to the loading direction and the slip lines were initiated.

本研究对厚度为100μm、缺口直径为0.5 mm的纯铜薄膜进行了疲劳实验，观察到了滑移等疲劳损伤。此外，根据EBSD(电子背散射衍射法)获得的晶体取向矩阵，计算了晶体的取向误差和取向误差。结果表明，随着疲劳试验的进行，铜薄膜中几乎所有颗粒的取向不均角都增大。在产生滑移线的晶体中，疲劳试验时取向不均的轴线偏向同一方向，而静载时则偏向散布方向。从偏向轴元件的变化来看，偏向轴向加载方向的横向倾斜并且朝向薄膜的面。随后，轴向加载方向移动，并启动了滑移线。

项目成果

混合モード条件下の疲労き裂におけるき裂開口とすべり変形挙動(膜厚の異なる銅薄膜材を用いて)

混合模态条件下疲劳裂纹的裂纹张开及滑动变形行为（采用不同膜厚的铜薄膜材料）

• 发表时间: 2011
• 作者: 山口徹也;清水憲一;皿井孝明
• 通讯作者: 皿井孝明

Fatigue Damage Behavior depending on the Bonding Interface Layer in Copper Film Bonded to Base Metals

疲劳损伤行为取决于与贱金属粘合的铜膜中的粘合界面层

• 发表时间: 2011
• 期刊: Key Engineering Materials
• 作者: Tashiyuki Torii;Koki Ishida*;Mohamed. K. Hassan** and Kenichi Shimizu(*Uchiyama Manufacturing Corp.;**South Valley University;Egypt)
• 通讯作者: Egypt)

EBSD 法を用いた銅膜材切欠き底の結晶方位測定と疲労損傷評価

EBSD法铜膜缺口底部晶体取向测量及疲劳损伤评价

• 发表时间: 2013
• 作者: 稲葉忠司;笠井裕一;渡邉隆司;加藤貴也;吉川高正;中野博子;棗田善貴,清水憲一,皿井孝明
• 通讯作者: 棗田善貴,清水憲一,皿井孝明

銅膜材の疲労破壊挙動に及ぼす樹脂接着効果とその支配要因(疲労過程のSEM観察と平均応力の影響に注目して)

树脂粘附效应及其对铜膜材料疲劳断裂行为的控制因素（重点关注疲劳过程的SEM观察和平均应力的影响）

• 发表时间: 2011
• 期刊: 材料システム
• 作者: Yonekura D;et al;石田浩規*,鳥居太始之,清水憲一*(*内山工業)
• 通讯作者: 石田浩規*,鳥居太始之,清水憲一*(*内山工業)

Fatigue Fracture Behavior of MEMS Cu Thin Films

MEMS 铜薄膜的疲劳断裂行为

• 发表时间: 2010
• 期刊: 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale
• 作者: Mohamed. K. Hassan*;Tashiyuki Torii;Koki Ishida** and Kenichi Shimizu(*South Valley University;Egypt;**Uchiyama Manufacturing Corp.)
• 通讯作者: **Uchiyama Manufacturing Corp.)