Development of strain measurement system in microscopic area using EBSD method

本研究对厚度为100μm、缺口为0.5mm的纯铜膜进行了疲劳处理，观察到了滑移引发等疲劳损伤。此外，利用电子背散射衍射（EBSD）方法得到的晶体取向矩阵计算了取向偏差和取向偏差轴。结果表明，随着疲劳试验的进行，铜膜中几乎所有晶粒的取向角都增加了。在产生滑移线的晶粒中，在疲劳试验中，滑移轴向同一方向倾斜，在静载荷作用下，滑移轴向散射方向倾斜。从一个错向轴元的变化来看，错向轴向加载方向和膜面横向倾斜。随后，轴向加载方向倾斜，开始出现滑移线。

In this study, the pure copper film of 100μm thickness with a 0.5mm notch hole was fatigued and the fatigue damage such as a slip initiation was observed. Moreover, a misorientation and a misorientation axis were computed from crystal orientation matrices obtained by using the EBSD (Electron Backscatter Diffraction) method. As a result, a misorientation angle increased with fatigue testing in almost all the grains of the copper film. In the crystal grain in which slip lines are generated, misorientation axes are inclined to the same direction by fatigue testing, while those turn to a scattering directions for the static loading. From the change of a misorientation axis element, the misorientation axes are inclined toward the transverse direction to the loading direction and in face of the film. Subsequently, the axes tended to the loading direction and the slip lines were initiated.