Development of Simulator for Transient Electrothermal Properties of Nanoscale Devices
Development of Simulator for Transient Electrothermal Properties of Nanoscale Devices
批准号:
22560330
负责人:
KAMAKURA Yoshinari
金额:
$2.83万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2010
资助国家:
日本
项目状态:
已结题
起止时间:
2010 至 2012
中文摘要
利用耦合蒙特卡罗方法求解电子和声子的玻尔兹曼输运方程,建立了纳米硅器件的暂态电热模拟程序。为此,提出了模拟声子输运和Seebeck效应的新算法。提出了用等效热路模型来描述热斑产生和消散的模拟观测结果。
英文摘要
Using a coupled Monte Carlo technique for solving both electron and phonon Boltzmann transport equations, the transient electrothermal simulator for nanoscale Si devices was developed. To this end, novel algorithms for simulating phonon transport and Seebeck effects were proposed. It has been also suggested that the simulated observations on the hot spot generation and dissipation can be practically described by the equivalent thermal circuit model.
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Characteristics of Hot Hole Injection,Trapping, and Detrapping in Gate Oxide of Polycrystalline Silicon Thin-Film Transistors
多晶硅薄膜晶体管栅氧化层热空穴注入、俘获和去俘获特性
DOI:
--
发表时间:
2012
期刊:
Jpn. J. Appl. Phys.
影响因子:
--
作者:
[Yoshinari Kamakura, Takashi Himukashi, Hiroshi Tsuji, and Kenji Taniguchi]
通讯作者:
and Kenji Taniguchi
Monte Carlo Simulation of Seebeck Coefficient of Si Nanostructure with Barrier Layers
带势垒层硅纳米结构塞贝克系数的蒙特卡罗模拟
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[Indra Nur Adisusilo, Kentaro Kukita, and Yoshinari Kamakur]
通讯作者:
and Yoshinari Kamakur
Influence of Phonon Dispersion Relation on Thermal Resistance in Silicon Nanostructures
声子色散关系对硅纳米结构热阻的影响
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[Kentaro Kukita, Indra Nur Adisusilo, and Yoshinari Kamakura]
通讯作者:
and Yoshinari Kamakura
Molecular Dynamics Simulation on LO Phonon Mode Decay in Si Nano-Structure Covered with Oxide Films
氧化膜覆盖硅纳米结构LO声子模衰变的分子动力学模拟
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
[T.Zushi, Y.Kamakura, K.Taniguchi, I.Ohdomari, T.Watanabe]
通讯作者:
T.Watanabe
DOI:
10.1143/jjap.49.04dn08
发表时间:
2010-04
期刊:
Japanese Journal of Applied Physics
影响因子:
1.5
作者:
[T. Zushi;Y. Kamakura;K. Taniguchi;I. Ohdomari;Takanobu Watanabe]
通讯作者:
T. Zushi;Y. Kamakura;K. Taniguchi;I. Ohdomari;Takanobu Watanabe
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