Development of holonomic and omnidirectional precise inchworm mechanism for surface chip mounting technology

本研究的目的是开发用于精密三自由度全方位尺虫移动机构的表面贴装技术。本文的研究成果概括如下：(1)论证了液体搭桥力的拾放法。(2)实现了电磁力的改进，提高了最大速度和定位精度。(3)研究了机构的暂态响应，计算了压电作动器的最优位移形状。我们还开发了FF/FB控件，以获得0。机构在1轴上的定位分辨率为05μm。在实验中，我们将稳定时间降到了0。当目标位置小于30μm时，机构具有较好的定位重复性，即最终位置的3σ为0。09μm，平均CV为0。结果表明，该方法能将振动、能量、尺寸降低到常规方法的1/1000，具有很好的可行性。

Purpose of this research is to develop surface mounting technology used by precise 3 DOF omidirectional inchworm mobile mechanism. Achievements of this study are summarized as below,(1) Demonstration of pick & place method used by liquid briding force.(2) We have achieved improvement of the electromagnetic force to increase both of maximum velocity and positioning accuracy.(3) We have studied transient response of the mechanism and calculated optimal shape of the displacement of the piezoelectric actuators. We have also developed FF/FB control to get 0. 05μm positioning resolution for the mechanism in 1 axis. In experiments, we get the settling time down to 0. 05s when the target position is less than 30μm. We have also checked that the mechanism has good positioning repeatability, i. e. 3σof final position is 0. 09μm and average CV is 0. 5%.(4) We show our method has good feasiblity to decrease vibration, energy, size down to 1/1000 of conventional methods.