Study on the mechanism of the sputtering deposition process and preparation of the new functional thin films

采用粉末靶溅射沉积法制备了功能薄膜。用朗缪尔探针法、光发射光谱法和激光光散射法研究了它们的沉积过程。实验结果表明，用粉末靶和块状靶制备的薄膜质量基本相同。而粉末靶的沉积速率比块状靶高2~5倍。溅射沉积的电子密度和Ti发射强度也比体靶高2~5倍。采用粉末靶的高电子密度可能是由于以下4个原因。1)靶的净表面积大于块状靶的净表面积。2)溅射离子斜入射到靶中。3)粉末靶的表面温度高于块状靶。4)靶中的空心阴极效应。

Functional thin films were prepared using sputtering deposition with powder target. Their deposition processes were also studied by Langmuir probe method, light emission spectroscopic method and laser light scattering method. Experimental results suggest that film quality using powder target were almost same compared with that using bulk target. However, deposition rate using powder target were 2~5 times higher than that using bulk target. Electron density and Ti emission intensity of the sputtering deposition methods were also 2~5 times higher than that using bulk target. The high electron density using powder target may be due to the 4 reasons as follows. 1)Net surface area of the target is larger than that of the bulk target. 2) Oblique incidence of sputtering ions into the target. 3)Surface temperature of the powder target is higher than that of the bulk target. 4)Hollow cathode effects in the target.