Study on the mechanism of the sputtering deposition process and preparation of the new functional thin films

采用粉末靶溅射法制备了功能薄膜。采用朗缪尔探针法、光发射光谱法和激光散射法研究了它们的沉积过程。实验结果表明，粉末靶与散装靶的膜质量基本一致。粉末靶材的沉积速率是块状靶材的2~5倍。溅射沉积方法的电子密度和钛发射强度也比采用体靶法的高2~5倍。使用粉末靶的高电子密度可能是由于以下4个原因。1)目标的净表面积大于散装目标的净表面积。2)溅射离子斜入射靶内。3)粉末靶材表面温度高于散装靶材表面温度。4)靶中的空心阴极效应。

Functional thin films were prepared using sputtering deposition with powder target. Their deposition processes were also studied by Langmuir probe method, light emission spectroscopic method and laser light scattering method. Experimental results suggest that film quality using powder target were almost same compared with that using bulk target. However, deposition rate using powder target were 2~5 times higher than that using bulk target. Electron density and Ti emission intensity of the sputtering deposition methods were also 2~5 times higher than that using bulk target. The high electron density using powder target may be due to the 4 reasons as follows. 1)Net surface area of the target is larger than that of the bulk target. 2) Oblique incidence of sputtering ions into the target. 3)Surface temperature of the powder target is higher than that of the bulk target. 4)Hollow cathode effects in the target.