Development of wheel spindle equiped with wheel infeed system
Development of wheel spindle equiped with wheel infeed system
批准号:
23560147
负责人:
YUI AKINORI
金额:
$3.33万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2013
中文摘要
点击翻译按钮获取中文摘要
英文摘要
A wheel spindle equipped with both rotary motion and axial infeed motion is developed. Since axial spindle position is monitored by using a capacitance type gap sensor and fed back to the linear actuator, axial spindle position can be precisely controlled even when variety of axial force is loaded during grinding. Due to the radial bearing employed water for working fluid, this system is environmental free. Rotational accuracy of the spindle is 0.23 micrometer, and static stiffness of axial direction was 1060 N/micrometer. As the results, surface roughness of ground silicon wafer, using the grain size of 3000 diamond wheel, was 2nmRa.
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
登录
查看更多内容
Development of a Vertical-spindle Rotary Surface Grinding Machine for Large Scale Silicon-wafers -Machine Specifications and Performance of Rotary Work Table
大型硅片立轴回转平面磨床的研制-机床规格及回转工作台性能
DOI:
--
发表时间:
2013
期刊:
Proceedings of the 13th euspen International Conference -Berlin
影响因子:
--
作者:
[A.Yui, S.Okuyama, T.Kitajima, G.Okahata, H.Saito, A.H.Slocum]
通讯作者:
A.H.Slocum
軸送り機能を有するスピンドル装置の開発
具有轴进给功能的主轴装置的开发
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[Keisuke Suzuki,Takashi Saito, Erika Karasudani, Tatsuya Korezawa, Panart Khajornrungruang, 本多歩,北嶋孝之,由井明紀]
通讯作者:
本多歩,北嶋孝之,由井明紀
軸方向送り機能を有するスピンドル装置の開発
具有轴向进给功能的主轴装置的研制
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[Keisuke Suzuki,Takashi Saito, Erika Karasudani, Tatsuya Korezawa, Panart Khajornrungruang, 本多歩,北嶋孝之,由井明紀, 本多歩,北嶋孝之,由井明紀]
通讯作者:
本多歩,北嶋孝之,由井明紀
Development of Vertical-Spindle Rotary Surface Grinding Machine for Large-Scale Silicon-Wafers –Static stiffness of grinding spindle and worktable–
大型硅片立轴回转平面磨床的研制-磨削主轴与工作台的静刚度-
DOI:
--
发表时间:
2014
期刊:
Proceedings of the 14th euspen International Conference -Dubrovnik
影响因子:
--
作者:
[A.Yui, A.Honda, T.Kitajima, H.Saito, X.Lu, A.H.Slocum]
通讯作者:
A.H.Slocum
Development of Vertical-spindle Rotary Surface Grinding Machine for Large Scale Silicon-wafers -Static stiffness of grinding spindle and worktable
大型硅片立轴回转平面磨床的研制-磨削主轴及工作台静刚度
DOI:
--
发表时间:
2014
期刊:
影响因子:
--
作者:
[A.Yui, A.Honda, T.Kitajima, H.Saito, X.Lu, A.H.Slocum]
通讯作者:
A.H.Slocum
共 7 条
海外基金