A study of low-temperature bonding of electronic device by using organic salt formation/decomposition reaction

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The application of low-temperature bonding in industrial processes has been explored in an effort to miniaturize electronic equipment. However, low-temperature bonding has been difficult to achieve because of the presence of oxide films, which inhibits the proper bonding. An economical method to obtain a high-strength joint at a low temperature and load is required. Earlier research showed that surface modification with formic acid decreased the bonding temperature in the solid-state bonding of Sn and Cu. Therefore, in this investigation we aimed to obtain a deeper understanding of the effect of surface modification on the performance of a solid-state bonded joint of Cu/Cu, Al/Al, Al/Cu and SUS304/Al alloy. When surface modification is applied, it is clarified that a high-tensile-strength joint is obtained at a low temperature because metallic Cu and Al are exposed as a result of the decomposition of formate in the bond interface at a low bonding temperature.